RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU47DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU48DR-1FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU9EG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU19EG-1FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU47DR-1FFVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU49DR-1FSVF1760E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU6CG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

FH82RM590ESRKLR

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

UNSPECIFIED

CMOS

R-XXXS-X

MTFC8GLCDM-1MWT

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

P8279-5

Rochester Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

70 Cel

0 Cel

DUAL

5.08 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

52.26 mm

CMOS

5 V

2.54 mm

R-PDIP-T40

XCZU19EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU27DR-1FFVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU27DR-2FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU3EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU47DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU48DR-2FFVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU6EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9CG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

BD82HM55SLGZS

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

1071

BGA

RECTANGULAR

UNSPECIFIED

YES

1.05,1.5,1.8,3.3,5

GRID ARRAY

BGA1071(UNSPEC)

UNSPECIFIED

CMOS

Bus Controllers

Not Qualified

CDP68HC68P1M

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

8

5

SMALL OUTLINE

SOP16,.25

3 V

85 Cel

-55 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

240

9.9 mm

CMOS

3.3 V

Parallel IO Port

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

CY8C20055-24SXI

Infineon Technologies

PROGRAMMABLE SoC

GULL WING

16

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1.71 V

85 Cel

-40 Cel

DUAL

CMOS

R-PDSO-G16

3

CY8C24533-24PVXI

Infineon Technologies

PROGRAMMABLE SYSTEM ON CHIP

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

3 V

85 Cel

-40 Cel

DUAL

2 mm

5.3 mm

10.2 mm

CMOS

3.3 V

.65 mm

R-PDSO-G28

CY8CPLC20-28PVXI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

20

260

10.2 mm

CMOS

14 mA

5 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

3

Not Qualified

e3

CYTMA525-49FNI25ZZT

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

BALL

49

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY

1.71 V

BOTTOM

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

CMOS

R-PBGA-B49

MTFC64GJVDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

QG6402/SL9XC

Intel

BALL

655

FBGA

RECTANGULAR

PLASTIC

YES

1.5,1.8,3.3

GRID ARRAY, FINE PITCH

BGA655,23X29,32

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

R-PBGA-B655

Not Qualified

SI3454-B01-IM

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

38

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

5 mm

40

260

7 mm

CMOS

3.3 V

.5 mm

R-XQCC-N38

3

e3

TMP82C79P-2

Toshiba

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

4.8 mm

15.24 mm

50.7 mm

5 mA

5 V

2.54 mm

R-PDIP-T40

Not Qualified

e0

XCZU15EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU15EG-L1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU17EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-3FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU19EG-L2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU21DR-2FFVD1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU27DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU27DR-2FSVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU28DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU28DR-L2FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU2CG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.61 mm

19 mm

30

250

19 mm

CMOS

.85 V

.8 mm

R-PBGA-B484

4

e1

XCZU47DR-1FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU48DR-2FSVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.