RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU9EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
ST33HTPH2E28AAF0	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						9.7 mm		CMOS			1.8 V						.65 mm	R-PDSO-G28
ST33HTPH2E28AHD0	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	9.7 mm		CMOS			1.8 V						.65 mm	R-PDSO-G28
XCZU4EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
XCZU5EG-2FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS			.85 V						1 mm	R-PBGA-B900	4			e1
LTC4263IDE-1#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm						30	260	4 mm		CMOS			5 V						.5 mm	R-PDSO-N14	1	Not Qualified		e3
MSP430F6779IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
MSP430F6779IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
TEA1792TS/1,115	NXP Semiconductors			GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES						20	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37							DUAL												260						20 V		Other Microprocessor ICs				.95 mm	R-PDSO-G6	1	Not Qualified
XCZU5EV-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS			.72 V							R-PBGA-B784	4			e1
XCZU7EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
MSP430F6779AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
SCANSTA111MT/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.1 mm			6.1 mm						30	260	12.5 mm		CMOS			3.3 V		Other Microprocessor ICs				.5 mm	R-PDSO-G48	2	Not Qualified		e3
XCZU11EG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1517	4			e1
XCZU19EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.71 mm			42.5 mm						30	245	42.5 mm		CMOS			.85 V						1 mm	R-PBGA-B1760	4			e1
XCZU7EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
XCZU7EG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.97 mm			31 mm						30	245	31 mm		CMOS			.85 V						1 mm	R-PBGA-B900	4			e1
XCZU7EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.9 V							R-PBGA-B1156	4			e1
XCZU7EG-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B1156	4			e1
XCZU7EG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B900	4			e1
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel		0 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS								SPI	.5 mm	R-PDSO-N8
MAXQ1061EUD+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES										109 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL											30	260			CMOS										R-PDSO-G14	1			e3
XCZU7EG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
XCZU9EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.42 mm			35 mm						30	245	35 mm		CMOS			.85 V						1 mm	R-PBGA-B1156	4			e1
ATECC608B-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm			2 mm				0	1 MHz			3 mm		CMOS									.5 mm	R-PDSO-N8				e4
ST33HTPH2028AHD1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	9.7 mm		CMOS			1.8 V						.65 mm	R-PDSO-G28
ST33HTPH2E28AAF1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						9.7 mm		CMOS			1.8 V						.65 mm	R-PDSO-G28
XCZU28DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1517	4			e1
XCZU3CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS			.85 V							R-PBGA-B484	4			e1
XCZU7EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
ATECC608A-MAHK2-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS									.5 mm	R-PDSO-N8
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm			2 mm				0	1 MHz			3 mm		CMOS									.5 mm	R-PDSO-N8				e4
DS28CM00R-A00+U	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V						SMALL OUTLINE		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL							ALSO AVAILABLE IN 5V				30	260			CMOS			1.8 V							R-PDSO-G5	1			e3
MTFC4GMVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS			1.8 V						.5 mm	R-PBGA-B153				e1
XCZU17EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1760	4			e1
XCZU19EG-L2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B1760	4			e1
XCZU5EG-2FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS			.85 V						1 mm	R-PBGA-B900	4			e1
XCZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS			.72 V							R-PBGA-B784	4			e1
XCZU6EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
XCZU7CG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS			.85 V						1 mm	R-PBGA-B1517	4			e1
9LPRS511EGLFT	Integrated Device Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20		70 Cel		0 Cel	TIN		DUAL												260			CMOS			3.3 V		Clock Generators				.5 mm	R-PDSO-G64	1	Not Qualified		e3
XCZU4CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
XCZU5CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS			.85 V						1 mm	R-PBGA-B900	4			e1
XCZU5EG-2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS			.85 V						.8 mm	R-PBGA-B784	4			e1
AGFA006R16A2E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES										100 Cel		0 Cel			BOTTOM																									R-PBGA-B1546
AGFA027R24C2E3E	Intel	SoC FPGA		BALL	2340		RECTANGULAR	PLASTIC/EPOXY	YES										100 Cel		0 Cel			BOTTOM																									R-PBGA-B2340
AGIB022R31B1E2V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES										100 Cel		0 Cel			BOTTOM																									R-PBGA-B3184
AGIB027R31B2E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES										100 Cel		0 Cel			BOTTOM																									R-PBGA-B3184

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.