RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU7EV-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
XCZU7EV-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
ATWINC1500-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM					NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS		3.6 V										R-XXMA-N28
CC3220MODSF12MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0		NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
XCZU7EV-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V								GRID ARRAY		.698 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS		.72 V										R-PBGA-B1156	4				e1
BM83SM1-00AA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel			-40 Cel	GOLD OVER NICKEL		UNSPECIFIED		2.5 mm			15 mm								260	32 mm			CMOS		3.8 V								1 mm		R-XXMA-N50	1
XCZU2CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B484	4				e1
ATECC508A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED		YES	5.5 V		TS 16949						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm							40	260	3 mm			CMOS										.5 mm		R-PDSO-N8	1
XCZU3CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B484	4				e1
ATECC608A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel			DUAL		.6 mm			2 mm									3 mm			CMOS										.5 mm		R-PDSO-N8
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm									21.72 mm			CMOS		3.3 V										R-XXMA-N28
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1517	4				e1
AX8052F143-3-TX40	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V								CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC40,.2X.28,20	1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS		3 V								.5 mm		R-PQCC-N40	1
CY8CPLC10-28PVXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V							5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel			-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm							20	260	10.2 mm			CMOS		5 V				Other uPs/uCs/Peripheral ICs				.65 mm		R-PDSO-G28	3	Not Qualified			e3
XCZU3EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B784	4				e1
CY8CPLC10-28PVXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V							5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel			-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm							20	260	10.2 mm			CMOS		5 V				Other uPs/uCs/Peripheral ICs				.65 mm		R-PDSO-G28	3	Not Qualified			e3
XCZU7EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V								GRID ARRAY		.873 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS		.9 V										R-PBGA-B900	4				e1
ATSHA204A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm							30	260	3 mm			CMOS		3.3 V								.5 mm		R-PQCC-N8	1				e4
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel			-40 Cel	NICKEL GOLD PALLADIUM		QUAD		1 mm			5 mm							30	260	7 mm			CMOS		3 V								.5 mm		R-XQCC-N40	1
LTC4263IS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		1.752 mm			3.899 mm							30	260	8.649 mm			CMOS		5 V								1.27 mm		R-PDSO-G14	1	Not Qualified			e3
XCZU11EG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
ATSHA204A-XHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.25	2 V	85 Cel			-40 Cel			DUAL		1.2 mm			3 mm									4.4 mm			CMOS		3.3 V								.65 mm		R-PDSO-G8
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM					NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS		3.6 V										R-XXMA-N28
ATECC608A-SSHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949						SMALL OUTLINE	SOP8,.23	2 V	85 Cel			-40 Cel			DUAL		1.75 mm			3.9 mm									4.9 mm			CMOS										1.27 mm		R-PDSO-G8
XCZU11EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1517	4				e1
XCZU11EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1760	4				e1
BM83SM1-00TA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED		YES	4.2 V								MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel			-40 Cel	GOLD OVER NICKEL		UNSPECIFIED		2.5 mm			15 mm								260	32 mm			CMOS		3.8 V								1 mm		R-XXMA-N50	1
XCZU4CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B900	4				e1
XCZU5EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B784	4				e1
LTC4263CS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE		4.5 V	70 Cel			0 Cel	MATTE TIN		DUAL		1.752 mm			3.899 mm							30	260	8.649 mm			CMOS		5 V								1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MCP25050T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel			-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm									8.65 mm			CMOS		5 V				Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MSP430F67791AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		32768	CMOS	6-Ch 10-Bit	3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm		e4	8	90
XCZU2EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B625	4				e1
XCZU3EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	TIN SILVER COPPER		BOTTOM																	CMOS		.85 V										R-PBGA-B484	4				e1
SLB9665XT20FW563XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	3 V	85 Cel			-40 Cel	TIN		DUAL		1.1 mm			4.4 mm									9.7 mm			CMOS		3.3 V								.65 mm		R-PDSO-G28	3				e3
XCZU2EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM																	CMOS		.85 V										R-PBGA-B484	4				e1
CC3220MODASM2MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					NO			CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit	3.3 V		NO			I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
XCZU25DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
XCZU25DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V								GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS		.72 V										R-PBGA-B1156	4				e1
LTC4263IDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm							30	260	4 mm			CMOS		5 V								.5 mm		R-PDSO-N14	1	Not Qualified			e3
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0		NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
XCZU25DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
XCZU2CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B625	4				e1
XCZU3CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS		.85 V										R-PBGA-B625	4				e1
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	12 V								IN-LINE		4.5 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12			0	.4 MHz	NOT SPECIFIED	260	9.81 mm			BIPOLAR		5 V							I2C	2.54 mm		R-PDIP-T8	1	Not Qualified			e4
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949		8			5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel			-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm									8.65 mm			CMOS		5 V				Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MTFC4GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V								GRID ARRAY, LOW PROFILE		2.7 V	85 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm			14 mm							30	260	18 mm			CMOS		3.3 V								1 mm		R-PBGA-B100					e1
NRF9160-SIAA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED		YES	5.5 V								GRID ARRAY	LGA127,21X30,20	3 V	85 Cel			-40 Cel			BOTTOM		1.1 mm			10.5 mm									16 mm			CMOS		3.8 V								.5 mm		R-XBGA-N127

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.