RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Information Access Method	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Interrupt Capability	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Minimum Time	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Volatile	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS				.72 V							R-PBGA-B625	4				e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM															CMOS				.85 V							R-PBGA-B484	4				e1
XCZU5EG-1SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY	BGA784,28X28,32		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS				.85 V						.8 mm	R-PBGA-B784	4				e1
XCZU7CG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B1517	4				e1
XCZU7EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B900	4				e1
XCZU9EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS				.72 V							R-PBGA-B900	4				e1
AR1100T-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		3.465 V	TS 16949					SMALL OUTLINE	SOP20,.4		3.135 V	85 Cel		-40 Cel	MATTE TIN		DUAL		2.65 mm			7.5 mm		ALSO OPERATES AT 5V SUPPLY						12.8 mm		CMOS				3.3 V						1.27 mm	R-PDSO-G20		Not Qualified			e3
ATECC108A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						40	260	3 mm		CMOS										.5 mm	R-PDSO-N8	1				e4
ATECC508A-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	3	LGA	RECTANGULAR	UNSPECIFIED	YES		5.5 V	TS 16949					GRID ARRAY			2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM		.55 mm			2.5 mm								6.5 mm		CMOS										2 mm	R-XLGA-N3
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE	SOP8,.23		2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm				0	1 MHz			4.9 mm		CMOS										1.27 mm	R-PDSO-G8					e4
DS2465P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES		3.63 V						SMALL OUTLINE			2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL		1.5 mm			3.76 mm						30	260	3.94 mm		CMOS				3.3 V						1.27 mm	R-PDSO-C6	1				e3
FM31256-G	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	SERIAL, FIXED PROTOCOL	5.5 V					3/5	SMALL OUTLINE	SOP14,.25	N	2.7 V	85 Cel		-40 Cel	PURE TIN		DUAL		1.75 mm			3.9 mm						30	260	8.64 mm		CMOS			SECONDS	3 V		Timer or RTC				1.27 mm	R-PDSO-G14	3	Not Qualified		NO
FSC-BT802	Shenzhen Feasycom	SoC		NO LEAD	36	QMA	RECTANGULAR	UNSPECIFIED	YES		3.6 V						MICROELECTRONIC ASSEMBLY			3 V	85 Cel		-40 Cel			QUAD					9.7 mm		BOX PACKAGE METHOD IS AVAILABLE WITH 2000PCS OF PACKAGE QUANTITY						11.5 mm		CMOS				3.3 V						1 mm	R-XQMA-N36
HCTL-2021	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	20		RECTANGULAR	UNSPECIFIED	NO		5.5 V						MICROELECTRONIC ASSEMBLY			4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL												260			CMOS				5 V							R-XDMA-P20		Not Qualified			e3
HT82K628A(40DIP)	Holtek Semiconductor	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO							5	IN-LINE	DIP40,.6			70 Cel		-25 Cel			DUAL															CMOS		5 mA		5 V		Other Microprocessor ICs				2.54 mm	R-PDIP-T40		Not Qualified
LTC4263CDE#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			4.5 V	70 Cel		0 Cel	MATTE TIN		DUAL		.8 mm			3 mm						30	260	4 mm		CMOS				5 V						.5 mm	R-PDSO-N14	1	Not Qualified			e3
MAXQ1061EUD+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES												109 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL											30	260			CMOS											R-PDSO-G14	1				e3
MFRC53101T/0FE,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES							3.3/5,5	SMALL OUTLINE	SOP32,.4			85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		DUAL											30	250					150 mA				Other Microprocessor ICs				1.27 mm	R-PDSO-G32	1	Not Qualified			e4
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES		1.03 V									.97 V	100 Cel		0 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS				1 V							R-PBGA-B325
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES		1.03 V									.97 V	100 Cel		0 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS				1 V							R-PBGA-B325
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES		1.03 V									.97 V	100 Cel		-40 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS				1 V							R-PBGA-B325
MSP430F67651AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67751AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67781AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES		3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH			2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit			3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm		e4	8	90
ST33GTPMA020FAE5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			AEC-Q100					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		also operates with 3.3v and 5v nominal						6.5 mm		CMOS				1.8 V						.65 mm	R-PDSO-G20
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B1156	4				e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B1760	4				e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B1517	4				e1
XCZU11EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.927 V						GRID ARRAY			.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.9 V							R-PBGA-B1156	4				e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B1924	4				e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS				.85 V							R-PBGA-B484	4				e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS				.72 V							R-PBGA-B484	4				e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS				.72 V							R-PBGA-B900	4				e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS				.72 V							R-PBGA-B784	4				e1
XCZU4EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS				.72 V							R-PBGA-B900	4				e1
XCZU5CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS				.85 V							R-PBGA-B900	4				e1
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY	BGA900,30X30,40		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS				.85 V						1 mm	R-PBGA-B900	4				e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY	BGA784,28X28,32		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250	23 mm		CMOS				.72 V						.8 mm	R-PBGA-B784	4				e1
XCZU5EG-L2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY	BGA784,28X28,32		.698 V	110 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250	23 mm		CMOS				.72 V						.8 mm	R-PBGA-B784	4				e1
XCZU5EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.876 V						GRID ARRAY			.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS				.85 V							R-PBGA-B784	4				e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES		.742 V						GRID ARRAY			.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS				.72 V							R-PBGA-B1517	4				e1
ATAES132A-SHEQ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V	TS 16949					SMALL OUTLINE	SOP8,.25		2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS				3.3 V						1.27 mm	R-PDSO-G8	3
ATAES132A-SHEQ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V	TS 16949					SMALL OUTLINE	SOP8,.25		2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS				3.3 V						1.27 mm	R-PDSO-G8
ATAES132A-SHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V	TS 16949					SMALL OUTLINE	SOP8,.25		2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm							260	4.9 mm		CMOS				3.3 V						1.27 mm	R-PDSO-G8	1
ATECC108A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE	SOP8,.23		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm						40	260	4.9 mm		CMOS										1.27 mm	R-PDSO-G8	3				e4
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE	SOP8,.23		2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS										1.27 mm	R-PDSO-G8					e4
ATECC608B-MAVDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		2 V	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						30	260	3 mm		CMOS									I2C	.5 mm	R-PDSO-N8	1				e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V						SMALL OUTLINE	SOP8,.23		2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm				0	1 MHz			4.9 mm		CMOS										1.27 mm	R-PDSO-G8					e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.