RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AGIB027R31B2I1V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel		-40 Cel			BOTTOM																		R-PBGA-B3184
AGIB027R31B2I3V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel		-40 Cel			BOTTOM																		R-PBGA-B3184
AGIB027R31B3E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel		0 Cel			BOTTOM																		R-PBGA-B3184
MXD1210EWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD		DUAL	1.75 mm			3.9 mm					9.9 mm		CMOS	.5 mA	5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e0
MXD1210EWE+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm			3.9 mm			30	260	9.9 mm		CMOS		5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e3
TA100-Y230C2X01-00T-VAO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100				SMALL OUTLINE	SOP8,.23	2.7 V	125 Cel		-40 Cel			DUAL	1.75 mm			3.9 mm					4.9 mm		CMOS						1.27 mm	R-PDSO-G8
XCZU48DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							30	240			CMOS		.85 V					R-PBGA-B1517	4			e1
ATECC608B-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V					CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel		-40 Cel			BOTTOM	.55 mm			2.5 mm					6.5 mm		CMOS					1-WIRE	2 mm	R-XBCC-N3
DH82Q87SR173	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED															UNSPECIFIED											CMOS
MXD1210CWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	70 Cel		0 Cel	TIN LEAD		DUAL	1.75 mm			3.9 mm					9.9 mm		CMOS	.5 mA	5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e0
MXD1210CWE+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm			3.9 mm			30	260	9.9 mm		CMOS		5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e3
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V					SMALL OUTLINE		2.7 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm			5.3 mm	CAN ALSO OPERATE AT 5V SUPPLY		30	260	6.2 mm		CMOS		3 V				1.27 mm	R-PDSO-G8	1	Not Qualified		e4
ATWINC1510-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM		NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.6 V					R-XXMA-N28
BM83SM1-00TB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel		-40 Cel			UNSPECIFIED	2.5 mm			15 mm					32 mm		CMOS		3.8 V				1 mm	R-XXMA-N50
ATAES132A-SHER-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.75 mm			3.9 mm				260	4.9 mm		CMOS		3.3 V				1.27 mm	R-PDSO-G8	1
ATWINC3400-MR210CA122-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.087 mm			14.732 mm	SEATED HGT-CALCULATED		NOT SPECIFIED	NOT SPECIFIED	22.428 mm		CMOS		3.6 V				1.204 mm	R-XXMA-N36
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V							.97 V	100 Cel		-40 Cel			BOTTOM					ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS		1 V					R-PBGA-B325
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	YES						CHIP CARRIER			40 Cel		0 Cel			BOTTOM	1.781 mm			3.18 mm			NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-PBCC-B25
XCZU11EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU4EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	250			CMOS		.85 V					R-PBGA-B784	4			e1
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm			5 mm			30	260	7 mm		CMOS		3 V				.5 mm	R-XQCC-N40	1
DS28E36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	.8 mm			3 mm			30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
DS8023-RJX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm			30	260	9.7 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			.65 mm	R-PDSO-G28	1	Not Qualified		e3
DS8023-RJX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm	ALSO AVAILABLE IN 5V		30	260	9.7 mm		CMOS		3.3 V				.65 mm	R-PDSO-G28	1			e3
DS8023-RRX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				3.3,5	SMALL OUTLINE	SOP28,.4	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm			30	260	17.9 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			1.27 mm	R-PDSO-G28	1	Not Qualified		e3
DS8023-RRX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V					SMALL OUTLINE		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm	ALSO AVAILABLE IN 5V		30	260	17.9 mm		CMOS		3.3 V				1.27 mm	R-PDSO-G28	1			e3
FH82CM246SR40E	Intel	MICROPROCESSOR CIRCUIT					RECTANGULAR	UNSPECIFIED																										CMOS
LTC4263IDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	.8 mm			3 mm			30	260	4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e3
LTC4263IS#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	1.752 mm			3.899 mm			30	260	8.649 mm		CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MSP430F67791IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm		0	30	260	20 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
MTFC16GJDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			14 mm			30	260	18 mm		CMOS		3.3 V				1 mm	R-PBGA-B100				e1
XCZU19EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B1760	4			e1
XCZU27DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM							30	240			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							30	245			CMOS		.72 V					R-PBGA-B1517	4			e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							30	240			CMOS		.72 V					R-PBGA-B1156	4			e1
XCZU4EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU7CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU7CG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU7CG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU7CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	2.97 mm			31 mm			30	245	31 mm		CMOS		.85 V				1 mm	R-PBGA-B900	4			e1
ATWINC1500-MR210UB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel	MATTE TIN		UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM				21.72 mm		CMOS		3.6 V					R-XXMA-N28				e3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL	4.318 mm			7.62 mm					19.05 mm		CMOS		5 V	Parallel IO Port			2.54 mm	R-PDIP-T14		Not Qualified		e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm			3.9 mm					8.65 mm		CMOS		5 V	Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm			3.9 mm					8.65 mm		CMOS		5 V	Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
SLE952500000XTSA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1.6 V					GRID ARRAY	SOLCC6,.04,20	1.35 V	85 Cel		-40 Cel			BOTTOM	.4 mm			1.1 mm	ALSO OPERATES WITH 3.8V NOM SUPPLY				1.5 mm		CMOS		1.45 V				.5 mm	R-PBCC-N6	1
XCZU17EG-2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.71 mm			42.5 mm			30	245	42.5 mm		CMOS		.85 V				1 mm	R-PBGA-B1760	4			e1
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250			CMOS		.72 V					R-PBGA-B484	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.