RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU49DR-1FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-2FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-L2FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU4EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU6CG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7EG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EV-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XCZU9CG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

HSA2-040SAA/A2320A

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.465 V

SMALL OUTLINE

SOP28,.4

3.135 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2.64 mm

7.49 mm

17.87 mm

CMOS

3.3 V

USB

1.27 mm

R-PDSO-G28

1

e3

HS12-100S0S/12SS30

Microchip Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP20,.4

70 Cel

0 Cel

DUAL

2.64 mm

7.49 mm

Touch Screen Microcontroller

12.8 mm

CMOS

1.27 mm

R-PDSO-G20

HSA2-040SCA/A2324

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

RECTANGULAR

PLASTIC/EPOXY

YES

3.465 V

3.135 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

250

CMOS

3.3 V

R-PDSO-G28

1

e3

ADUCM330WFSBCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

18 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.24SQ,20

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

SPI

.5 mm

S-XQCC-N32

AMZ8127DMB

Advanced Micro Devices

MILITARY

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC

NO

MIL-STD-883 Class B (Modified)

IN-LINE

DIP24,.3

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

ECL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T24

Not Qualified

e0

AT97SC3205-U3A15-20

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

0

NO

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

85 Cel

-40 Cel

MATTE TIN

NO

DUAL

NO

1.1 mm

4.4 mm

0

9.7 mm

CMOS

3.3 V

NO

EEPROM

I2C

.65 mm

R-PDSO-G28

33 rpm

e3

6

ATECC108A-SSHDA-B

Microchip Technology

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP8,.23

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.75 mm

3.9 mm

40

260

4.9 mm

CMOS

1.27 mm

R-PDSO-G8

3

e4

ATECC608A-TNGTLSU-G

Microchip Technology

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

2 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

.6 mm

2 mm

3 mm

CMOS

I2C

.5 mm

R-PDSO-N8

e4

ATSHA204A-SSHCZ-T

Microchip Technology

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

3

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

SMALL OUTLINE

SOP8,.25

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G8

ATTPM20P-G6MA1-10

Microchip Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

TS 16949

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

1.8 V

70 Cel

0 Cel

DUAL

.6 mm

2 mm

3 mm

CMOS

SPI

.5 mm

R-PDSO-N8

ATWINC3400-MR210CA131-T

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

2.5 V

85 Cel

-40 Cel

UNSPECIFIED

2.0874 mm

14.732 mm

SEATED HGT-CALCULATED

NOT SPECIFIED

NOT SPECIFIED

22.3774 mm

CMOS

3.6 V

1.204 mm

R-XXMA-N36

CSR8811A08-ICXR-R

Qualcomm

MICROPROCESSOR CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.3 V

85 Cel

-30 Cel

BOTTOM

.6 mm

2.569 mm

3.208 mm

CMOS

3.3 V

.5 mm

R-PBGA-B28

1

HSA2-040SCA/A2320A

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

RECTANGULAR

PLASTIC/EPOXY

YES

3.465 V

3.135 V

85 Cel

-40 Cel

MATTE TIN

DUAL

250

CMOS

3.3 V

R-PDSO-G28

1

e3

HSA2-040SCA/A2324TR

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.465 V

SMALL OUTLINE

3.135 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

250

CMOS

3.3 V

R-PDSO-G28

1

e3

M82710-14

Mindspeed Technologies

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

GRID ARRAY

110 Cel

-25 Cel

BOTTOM

CMOS

R-PBGA-B484

SN74LS783N

Motorola

MICROPROCESSOR CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

IN-LINE

DIP40,.6

4.75 V

75 Cel

0 Cel

TIN LEAD

DUAL

5.08 mm

15.24 mm

52.07 mm

BIPOLAR

230 mA

5 V

Memory Controllers

2.54 mm

R-PDIP-T40

Not Qualified

e0

XCZU15EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU6CG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

ZL30255LFF7

Microchip Technology

CLOCK GENERATOR, OTHER

NO LEAD

64

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

BGA64,8X8,32

1.71 V

85 Cel

-40 Cel

BOTTOM

1 mm

5 mm

10 mm

CMOS

1.8 V

.4 mm

R-XQCC-N64

SN74ABT8996PWR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

4.4 mm

30

260

7.8 mm

BICMOS

5 V

Other Microprocessor ICs

.65 mm

R-PDSO-G24

1

Not Qualified

e4

SN74S428NP3

Texas Instruments

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

DUAL

BIPOLAR

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T28

TIM8228N

Texas Instruments

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP28,.6

70 Cel

0 Cel

DUAL

BIPOLAR

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T28

Not Qualified

SN74LS610N3

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

SN74AS852JT4

Texas Instruments

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP24,.3

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-XDIP-T24

SN74ALS6300DWR

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE

4.75 V

70 Cel

0 Cel

DUAL

2.65 mm

7.5 mm

15.4 mm

CMOS

185 mA

5 V

1.27 mm

R-PDSO-G24

Not Qualified

CACT8997DWRG4

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

5

SMALL OUTLINE

SOP28,.4

4.5 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

30

260

17.9 mm

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

1

Not Qualified

e4

TMS9903JDL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP20,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-XDIP-T20

Not Qualified

SN74LS611NP1

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

SN54ABT8996JT

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

5.5 V

5

IN-LINE

DIP24,.3

4.5 V

125 Cel

-55 Cel

DUAL

5.08 mm

7.62 mm

NOT SPECIFIED

NOT SPECIFIED

32.005 mm

BICMOS

18 mA

5 V

Other Microprocessor ICs

2.54 mm

R-GDIP-T24

Not Qualified

DP84902MS

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

4.5 V

70 Cel

0 Cel

DUAL

2.05 mm

5.3 mm

7.2 mm

CMOS

5 V

.65 mm

R-PDSO-G20

SN74LVT8980ADW

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3.3

SMALL OUTLINE

SOP24,.4

2.7 V

85 Cel

LVT

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

8

30

260

15.4 mm

CMOS

7 mA

3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

1

Not Qualified

e4

SN74LS613N1

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

SN74LVT8980AIDWREP

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3/3.3

SMALL OUTLINE

SOP24,.4

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

8

30

260

15.4 mm

BICMOS

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

1

Not Qualified

e4

SN74AS877ANT

Texas Instruments

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP24,.3

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T24

Not Qualified

SN74AS852JT

Texas Instruments

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP24,.3

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-XDIP-T24

Not Qualified

SN74ABT8996PW

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

4.5 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

4.4 mm

0

30

260

7.8 mm

BICMOS

5 V

Other Microprocessor ICs

.65 mm

R-PDSO-G24

1

Not Qualified

e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.