RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ATECC508A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED		YES	5.5 V	TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm	CMOS				.5 mm		R-PDSO-N8	1
ATECC508A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949		SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm				40	260	4.9 mm	CMOS				1.27 mm		R-PDSO-G8	3
AX-SIP-SFEU-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	NICKEL GOLD PALLADIUM	BOTTOM	.996 mm	7 mm				30	260	9 mm	CMOS		3 V				R-XBCC-B44	3
MXD1210EWE-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	TIN LEAD	DUAL	1.75 mm	3.9 mm						9.9 mm	CMOS	.5 mA	5 V		1.27 mm		R-PDSO-G16	1	Not Qualified	e0
MXD1210EWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1.75 mm	3.9 mm						9.9 mm	CMOS	.5 mA	5 V		1.27 mm		R-PDSO-G16	1	Not Qualified	e3
TEA1791T/N1/G,118	NXP Semiconductors			GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES			20	SMALL OUTLINE	SOP8,.25					DUAL											20 V	Other Microprocessor ICs	1.27 mm		R-PDSO-G8		Not Qualified
XCZU11EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS		.85 V		1 mm		R-PBGA-B1760	4		e1
XCZU11EG-3FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.9 V				R-PBGA-B1517	4		e1
XCZU11EG-3FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.9 V				R-PBGA-B1760	4		e1
XCZU15EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B900	4		e1
XCZU15EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS		.72 V				R-PBGA-B900	4		e1
XCZU17EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU19EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU19EG-2FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU19EG-2FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm				30	245	45 mm	CMOS		.85 V		1 mm		R-PBGA-B1924	4		e1
XCZU27DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU49DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU4CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS		.85 V		1 mm		R-PBGA-B900	4		e1
XCZU4EG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B900	4		e1
XCZU4EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS		.85 V		.8 mm		R-PBGA-B784	4		e1
XCZU5EG-1FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS		.85 V		1 mm		R-PBGA-B900	4		e1
XCZU5EG-L1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245	31 mm	CMOS		.72 V		1 mm		R-PBGA-B900	4		e1
XCZU6EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B900	4		e1
XCZU7EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	4.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel		BOTTOM	.541 mm	2.142 mm						2.282 mm	CMOS		3.6 V		.35 mm		R-PBGA-B31
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V				R-XXMA-N28
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU11EG-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS		.72 V				R-PBGA-B1156	4		e1
XCZU2CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS		.72 V				R-PBGA-B625	4		e1
AX-SIP-SFEU-API-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	NICKEL GOLD PALLADIUM	BOTTOM	.996 mm	7 mm				30	260	9 mm	CMOS		3 V				R-XBCC-B44	3
SP1ML-868	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED		NO	3.6 V			MICROELECTRONIC ASSEMBLY		1.8 V	85 Cel	-40 Cel		DUAL	2.5 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3 V		1.5 mm		R-XDMA-N16
XCZU27DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU27DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
DS28E10R+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL						30	260		CMOS		3.3 V				R-PDSO-G3	1		e3
XCZU28DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.72 V				R-PBGA-B1517	4		e1
XCZU29DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1760	4		e1
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES				CHIP CARRIER	LGA25,3X8,27		40 Cel	0 Cel		BOTTOM	1.781 mm	3.18 mm		NO	4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V		.686 mm	FIXED POINT	R-PBCC-B25
THGBM5G6A2JBAIR	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm	11.5 mm						13 mm	CMOS		3.3 V		.5 mm		R-PBGA-B153
XCZU15EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.9 V				R-PBGA-B1156	4		e1
XCZU48DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM									CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU6CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
CY8C21534-24PVXIT	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V			SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			20	260	10.2 mm	CMOS		5 V		.65 mm		R-PDSO-G28	3		e3
EY82C621ASRH58	Intel	MICROPROCESSOR CIRCUIT		BALL	1310		RECTANGULAR	PLASTIC/EPOXY		YES										BOTTOM									CMOS						R-PBGA-B1310
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED		YES	3.8 V			MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel	-40 Cel		UNSPECIFIED	2.4 mm	12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE					15 mm	CMOS		3 V		1.2 mm		R-XXMA-N31	3
SI1000-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V			GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel	-40 Cel		BOTTOM	.95 mm	5 mm	ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.			40	260	7 mm	CMOS		1.9 V		.5 mm		R-XBGA-B42	2
XCZU17EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS		.85 V		1 mm		R-PBGA-B1760	4		e1
XCZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS		.72 V				R-PBGA-B784	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.