RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
NRF9160-SIAA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V						GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM		1.1 mm		10.5 mm							16 mm		CMOS			3.8 V					.5 mm	R-XBGA-N127
XCZU25DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1156	4			e1
XCZU25DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS			.85 V						R-PBGA-B1517	4			e1
XCZU25DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	240			CMOS			.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS			.72 V						R-PBGA-B1156	4			e1
XCZU5EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B900	4			e1
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm		17.5 mm	0		0		30	260	20.5 mm		CMOS	4-Ch 12-Bit		3.3 V	NO			I2C; SPI; UART	1.27 mm	R-XBCC-B63	3			e4	25
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm		11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS					13 mm		CMOS			1.8 V					.5 mm	R-PBGA-B153				e1
XCZU4EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B900	4			e1
SCANSTA111MTX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm		6.1 mm					30	260	12.5 mm		CMOS			3.3 V		Other Microprocessor ICs			.5 mm	R-PDSO-G48	2	Not Qualified		e3
XCZU7EV-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.9 V						R-PBGA-B1156	4			e1
XCZU11EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm		40 mm					30	245	40 mm		CMOS			.85 V					1 mm	R-PBGA-B1517	4			e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1156	4			e1
ATECC608A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949					SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel			DUAL		1.75 mm		3.9 mm							4.9 mm		CMOS								1.27 mm	R-PDSO-G8
MSP430F6748IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm	524288	14 mm			0	25 MHz	30	260	20 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
XCZU11EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1760	4			e1
XCZU5CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B900	4			e1
ATSHA204A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm		2 mm					40	260	3 mm		CMOS			3.3 V					.5 mm	R-PQCC-N8	1
XCZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	250			CMOS			.85 V						R-PBGA-B784	4			e1
XCZU48DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1156	4			e1
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8			5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm		3.9 mm							8.65 mm		CMOS			5 V		Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
XCZU25DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM									30	240			CMOS			.85 V						R-PBGA-B1517	4			e1
XCZU25DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	TIN SILVER COPPER		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B1517	4			e1
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM													CMOS			.85 V						R-PBGA-B484	4			e1
XCZU4EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	250			CMOS			.85 V						R-PBGA-B784	4			e1
XCZU5CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B900	4			e1
ATWINC1510-MR210PB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V						MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm		14.73 mm		SEATED HGT-NOM					21.72 mm		CMOS			3.6 V						R-XXMA-N28
FXLC95000CLR1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	24	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM		1.1 mm		3 mm					40	260	5 mm		CMOS			1.8 V					.5 mm	R-PBGA-B24	3
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm		11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS					13 mm		CMOS			1.8 V					.5 mm	R-PBGA-B153				e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel		-25 Cel			BOTTOM		1 mm		11.5 mm							13 mm		CMOS			3.3 V					.5 mm	R-PBGA-B153
XCZU7EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm		40 mm					30	245	40 mm		CMOS			.85 V					1 mm	R-PBGA-B1517	4			e1
XCZU7EG-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.9 V						R-PBGA-B1517	4			e1
XCZU7EG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B900	4			e1
CY8C4245PVI-DS402	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		2 mm		5.3 mm							10.2 mm		CMOS			3 V					.65 mm	R-PDSO-G28	3			e4
ESP32-WROOM-32UE-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V						MICROELECTRONIC ASSEMBLY		3 V	105 Cel		-40 Cel			UNSPECIFIED		3.35 mm		18 mm					30	250	19.2 mm		CMOS			3.3 V					1.27 mm	R-XXMA-N38	3
MCP2221T-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm		4.4 mm							5 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers			.65 mm	R-PDSO-G14		Not Qualified		e3
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm		11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS					13 mm		CMOS			1.8 V					.5 mm	R-PBGA-B153				e1
TEA1791T/N1,118	NXP Semiconductors			GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						20	SMALL OUTLINE	SOP8,.25							DUAL										260						20 V		Other Microprocessor ICs			1.27 mm	R-PDSO-G8	1	Not Qualified
XCZU7EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1517	4			e1
XCZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	250			CMOS			.85 V						R-PBGA-B625	4			e1
XCZU9CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1156	4			e1
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm		2 mm			0	1 MHz			3 mm		CMOS								.5 mm	R-PDSO-N8				e4
XCZU28DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B1517	4			e1
XCZU5EG-L2FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY	BGA900,30X30,40	.698 V	110 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.88 mm		31 mm		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245	31 mm		CMOS			.72 V					1 mm	R-PBGA-B900	4			e1
XCZU5EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B900	4			e1
XCZU11EG-L1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS			.72 V						R-PBGA-B1760	4			e1
XCZU15EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS			.85 V						R-PBGA-B900	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.