RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
ATSHA204A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						40	260	3 mm		CMOS		3.3 V						.5 mm	R-PQCC-N8	1
XCZU2CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS		.85 V							R-PBGA-B484	4			e1
XCZU4EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V							R-PBGA-B784	4			e1
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL		4.318 mm			7.62 mm							260	19.05 mm		CMOS		5 V		Parallel IO Port				2.54 mm	R-PDIP-T14		Not Qualified		e3
ATECC608B-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS							1-WIRE	.5 mm	R-PDSO-N8
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm							260	8.65 mm		CMOS		5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
NRF52811-CAAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel		-40 Cel			BOTTOM		.535 mm			2.464 mm								2.482 mm		CMOS		3 V						.4 mm	R-PBGA-B33
XCZU11EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS		.85 V						1 mm	R-PBGA-B1517	4			e1
XCZU4EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V							R-PBGA-B784	4			e1
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm		CMOS		3.3 V						1.27 mm	R-XXMA-N47				e4
ATECC608B-RBHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V							CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel		-40 Cel			BOTTOM		.55 mm			2.5 mm								6.5 mm		CMOS							1-WIRE	2 mm	R-XBCC-N3
PGA460TPW	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel			UNSPECIFIED		2.11 mm			14.73 mm					48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V							R-XXMA-N28
ATWINC1500-MR210PB1952-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V						1.016 mm	R-XXMA-N28
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V							R-XXMA-N28
ST4SIM-200M	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			RECTANGULAR	UNSPECIFIED	YES								UNCASED CHIP	DIE OR CHIP		105 Cel		-40 Cel			UNSPECIFIED															CMOS									R-XUUC-N
MSP430F6779AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
SLB9665TT20FW563XUMA3	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	3 V	85 Cel		-20 Cel	TIN		DUAL		1.1 mm			4.4 mm								9.7 mm		CMOS		3.3 V						.65 mm	R-PDSO-G28	3			e3
ST4SI2M0007AKIFW	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		105 Cel		-40 Cel			DUAL		1 mm			5 mm								6 mm		CMOS								1.27 mm	R-XDSO-N8
XCZU4EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B900	4			e1
MCP25050-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS		5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
XCZU4EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V						.8 mm	R-PBGA-B784	4			e1
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES								UNCASED CHIP			50 Cel		0 Cel			UPPER											NOT SPECIFIED	NOT SPECIFIED			CMOS		3.3 V							R-XUUC-N
ATSHA204A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949						SMALL OUTLINE	SOP8,.25	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS		3.3 V						1.27 mm	R-PDSO-G8	3
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL		4.318 mm			7.62 mm								19.05 mm		CMOS		5 V		Parallel IO Port				2.54 mm	R-PDIP-T14		Not Qualified		e3
XCZU4EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS		.85 V						1 mm	R-PBGA-B900	4			e1
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel		-40 Cel	GOLD OVER NICKEL		UNSPECIFIED		2.5 mm			15 mm							260	32 mm		CMOS		3.8 V						1 mm	R-XXMA-N50	1
XCZU9EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1156	4			e1
XCZU3EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS		.85 V							R-PBGA-B625	4			e1
ESP32-WROOM-32E(M113EH2800PH3Q0)	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES								MICROELECTRONIC ASSEMBLY								UNSPECIFIED		3.35 mm			18 mm								25.5 mm		CMOS								1.27 mm	R-XXMA-N38
XCZU7EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B900	4			e1
XCZU7EV-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B1517	4			e1
ATSHA204A-STUCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949						SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TO-236	2 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.12 mm			1.3 mm						40	260	2.9 mm		CMOS		3.3 V						.95 mm	R-PDSO-G3	1			e3
XCZU4EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V							GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.9 V							R-PBGA-B900	4			e1
XCZU7EV-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B1156	4			e1
RN2903A-I/RMSA103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.78 mm		SEATED HGT-CALCULATED					250	26.67 mm		CMOS		3.3 V						1.27 mm	R-XXMA-N47				e4
XCZU4EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B900	4			e1
XCZU7EV-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS		.85 V						1 mm	R-PBGA-B1517	4			e1
XCZU7EV-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1156	4			e1
XCZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS		.72 V							R-PBGA-B784	4			e1
P82B715P	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V							IN-LINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	NOT SPECIFIED	9.81 mm		BIPOLAR		5 V					I2C	2.54 mm	R-PDIP-T8		Not Qualified		e4
XCZU7EV-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			35 mm						30	245	35 mm		CMOS		.85 V						1 mm	R-PBGA-B1156	4			e1
XCZU7EV-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1517	4			e1
XCZU4CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B900	4			e1
ATECC608A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS								.5 mm	R-PDSO-N8
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm								21.72 mm		CMOS		3.3 V							R-XXMA-N28
ATWINC1500-MR210PB1961-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.6 V							R-XXMA-N28
XCZU5EG-1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V						.8 mm	R-PBGA-B784	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.