RECTANGULAR Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	.6 mm			2 mm		0	1 MHz			3 mm		CMOS						.5 mm	R-PDSO-N8				e4
ATTPM20P-H6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel			DUAL	.6 mm			2 mm						3 mm		CMOS		3.3 V			SPI	.5 mm	R-PDSO-N8
ATTPM20P-H6MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel			DUAL	.6 mm			2 mm						3 mm		CMOS		3.3 V			SPI	.5 mm	R-PDSO-N8
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm		CMOS		3.3 V					R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm		CMOS		3.3 V					R-XXMA-N28
ATWINC1510-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm		CMOS		3.3 V					R-XXMA-N28
ATWINC1510-MR210PB1963	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM					21.72 mm		CMOS		3.6 V					R-XXMA-N28
ATWINC1510-MR210PB1963-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED												CMOS		3.3 V			I2C, SPI		R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm						21.72 mm		CMOS		3.3 V					R-XXMA-N28
ATWINC3400-MR210UA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.087 mm			14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.428 mm		CMOS		3.6 V				1.204 mm	R-XXMA-N36
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE		2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.5 mm			3.76 mm				30	260	3.94 mm		CMOS		3.3 V				1.27 mm	R-PDSO-C6	1			e3
DS28C40G/V+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	.8 mm			3 mm				30	260	4 mm		CMOS		3.3 V				.5 mm	R-PDSO-N10	1			e3
IP2022/PQ80-120U	Qualcomm	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	2.7 V					FLATPACK		2.3 V	85 Cel		-40 Cel			QUAD	3.4 mm			14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm		CMOS		2.5 V				.8 mm	R-PQFP-G80
LTC4263IDE	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		DUAL	.8 mm			3 mm						4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e0
LTC4263IS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		DUAL	1.752 mm			3.9 mm						8.649 mm		CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e0
LTC4263IS#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD		DUAL	1.752 mm			3.9 mm						8.649 mm		CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e0
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm			3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm			3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MPFS250TL-FCG1152I	Microchip Technology	SoC FPGA		BALL	1152		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel		-40 Cel			BOTTOM												CMOS							R-PBGA-B1152
MSP430F67791IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm		0		30	260	20 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
MTCH6102-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	TS 16949				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	MATTE TIN		DUAL	2 mm			5.3 mm				40	260	10.2 mm		CMOS		3 V				.65 mm	R-PDSO-G28	2			e3
MTFC64GJDDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm			14 mm	IT ALSO OPERATES AT 3.3 VOLTS					18 mm		CMOS		1.8 V				.5 mm	R-PBGA-B169				e1
MTFC8GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	1.4 mm			14 mm				30	260	18 mm		CMOS		3.3 V				1 mm	R-PBGA-B100				e1
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES						MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel			UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM			30	260	5.59 mm		CMOS		1.25 V					R-XXMA-N25	3
SI1002-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED	YES	3.6 V					GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel		-40 Cel			BOTTOM	.95 mm			5 mm	ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.			NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		1.9 V				.5 mm	R-XBGA-B42
ST33GTPMA020FAE6	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel		-40 Cel			DUAL	1.2 mm			4.4 mm	also operates with 3.3v and 5v nominal					6.5 mm		CMOS		1.8 V				.65 mm	R-PDSO-G20	1
XCZU11EG-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V					R-PBGA-B1517	4			e1
XCZU11EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V					R-PBGA-B1760	4			e1
XCZU19EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU2EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY							CMOS		.72 V					R-PBGA-B484	4			e1
XCZU3CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	250			CMOS		.85 V					R-PBGA-B625	4			e1
XCZU3CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS		.72 V					R-PBGA-B625	4			e1
XCZU3EG-2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	2.61 mm			19 mm						19 mm		CMOS		.85 V				.8 mm	R-PBGA-B484	4			e1
XCZU49DR-2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM								30	245			CMOS		.85 V					R-PBGA-B1760	4			e1
XCZU4EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS		.72 V					R-PBGA-B784	4			e1
XCZU5EG-2SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm			23 mm				30	250	23 mm		CMOS		.85 V				.8 mm	R-PBGA-B784	4			e1
XCZU5EG-3FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY	BGA900,30X30,40	.873 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	2.88 mm			31 mm				30	245	31 mm		CMOS		.9 V				1 mm	R-PBGA-B900	4			e1
XCZU5EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	3.32 mm			23 mm				30	250	23 mm		CMOS		.85 V				.8 mm	R-PBGA-B784	4			e1
XCZU7CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM								30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU7EG-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm			35 mm				30	245	35 mm		CMOS		.85 V				1 mm	R-PBGA-B1156	4			e1
XCZU7EG-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU7EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V					R-PBGA-B900	4			e1
XCZU9CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU9EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	245			CMOS		.9 V					R-PBGA-B1156	4			e1
XCZU9EG-3FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								30	245			CMOS		.9 V					R-PBGA-B900	4			e1
XCZU9EG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V					R-PBGA-B900	4			e1
AGFA006R16A3E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel		0 Cel			BOTTOM																			R-PBGA-B1546
ATAES132A-MAHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	.6 mm			2 mm				40	260	3 mm		CMOS		3.3 V				.5 mm	R-PDSO-N8	1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.