NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

S32G274AAAK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

PM912KS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

14 mm

CMOS

.5 mm

S-PQFP-G100

T1024NXN7MQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

935261651112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

MPC17550VM

NXP Semiconductors

UDA1325H06B-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

3.2 mm

14 mm

ALSO REQUIRES 5V SUPPLY

20 mm

CMOS

3.3 V

1 mm

R-PQFP-G64

Not Qualified

935248340118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

2.7 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

ALSO REQUIRES 5V SUPPLY

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

P5CD051XE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

e4

P5CD041XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

e4

NHS3100W8/A1V

NXP Semiconductors

MICROPROCESSOR CIRCUIT

30

260

1

T1024NXNC4PNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1024NXE7KNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1024NXNC4MQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

MF0UL1101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

SL2S1412FUD,003

NXP Semiconductors

MICROPROCESSOR CIRCUIT

WAFER

Other Microprocessor ICs

Not Qualified

88MW320-A0-NAPE/AK

NXP Semiconductors

SoC

OTHER

260

3

S32G234MSAK0VUCT

NXP Semiconductors

SoC

INDUSTRIAL

P5CD020A6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X

Not Qualified

P5CC073XS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

PNX1300EH/G

NXP Semiconductors

P5CC128UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

CMOS

1.8 V

X-XUUC-N

P5CD145UE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

CMOS

1.8 V

X-XUUC-N

MF0ICU1001W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

BGM220

NXP Semiconductors

QFM-2202-A

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

47

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

105 Cel

-40 Cel

UNSPECIFIED

CMOS

3.3 V

R-XXMA-N47

SL3S1204FUD2/BG

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

85 Cel

-40 Cel

UPPER

CMOS

R-XUUC-N4

P5CD021UE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

P1021

NXP Semiconductors

P5CC073

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

SL2ICS1101DW/V4,00

NXP Semiconductors

MICROPROCESSOR CIRCUIT

DIE OR CHIP

Other Microprocessor ICs

Not Qualified

UDA1325PS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

PIN/PEG

42

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE, SHRINK PITCH

3 V

70 Cel

0 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

5.08 mm

15.24 mm

ALSO REQUIRES 5V SUPPLY

38.65 mm

CMOS

3.3 V

1.778 mm

R-PDIP-P42

Not Qualified

e3/e4

P5020

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

1295

RECTANGULAR

PLASTIC/EPOXY

YES

105 Cel

0 Cel

BOTTOM

ALSO OPERATES AT 3.3V AND 2.5V SUPPLY

CMOS

1.8 V

R-PBGA-B1295

T1024NXEC4MNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P5CD009EV1/XXX

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

PLASTIC/EPOXY

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

CMOS

Other Microprocessor ICs

Not Qualified

PM9Z1J638AM2EP

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.5 V

125 Cel

-40 Cel

QUAD

.9 mm

7 mm

7 mm

CMOS

6 V

.5 mm

S-XQCC-N48

PR601HL/C1,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3,5

FLATPACK

QFP100,.63SQ,20

70 Cel

-25 Cel

QUAD

Other Microprocessor ICs

.5 mm

S-PQFP-G100

Not Qualified

P5CD145AI

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

S32G234MSBK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

P5CD144UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

P5CD020X1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

MF1ICS5005W/V9D,00

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

WAFER

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD145X1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.98 V

MICROELECTRONIC ASSEMBLY

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

R-XDMA-X

S32G254ASBK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

NT2L1211G0DUFV

NXP Semiconductors

TDA8026ET/C2/S1,11

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

Not Qualified

P5CC144TS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

1.8/5

SMALL OUTLINE

SSOP20,.25

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

.635 mm

R-PDSO-G20

Not Qualified

SM912F634DV2AE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

TDA8002G/5/C2-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

4.5 V

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

5 mm

CMOS

5 V

.5 mm

S-PQFP-G32

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.