NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MCIMX6Q4AVT10AC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX6Y1DVK05AB

NXP Semiconductors

SoC

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA272,17X17,20

1.275 V

95 Cel

0 Cel

BOTTOM

1.23 mm

9 mm

40

260

9 mm

CMOS

.5 mm

S-PBGA-B272

3

LS1043ASN7KQLA

NXP Semiconductors

SYSTEM ON CHIP

INDUSTRIAL

BALL

621

HFBGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA621,25X25,32

.87 V

105 Cel

0 Cel

BOTTOM

2.07 mm

21 mm

21 mm

CMOS

.9 V

.8 mm

S-PBGA-B621

LS1043AXN8MNLA

NXP Semiconductors

SYSTEM ON CHIP

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.87 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

.9 V

.8 mm

S-PBGA-B780

MCIMX6X2EVN10AC

NXP Semiconductors

SoC

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.35 V

105 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.53 mm

17 mm

40

260

17 mm

CMOS

.8 mm

S-PBGA-B400

3

e1

LS1023AXE7QQB

NXP Semiconductors

SoC

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, FINE PITCH

BGA621,25X25,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

21 mm

30

250

21 mm

CMOS

1 V

.8 mm

S-PBGA-B621

3

LS1027A

NXP Semiconductors

SYSTEM ON CHIP

PN7161B1HN/C100

NXP Semiconductors

NFC CONTROLLER

SE051A2HQ1/Z01XE

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

SE051P2HQ1/Z011A

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

PN7161B1EV/C100

NXP Semiconductors

NFC CONTROLLER

LS1028A

NXP Semiconductors

SYSTEM ON CHIP

LS1017A

NXP Semiconductors

SYSTEM ON CHIP

PN7160A1HN/C100

NXP Semiconductors

NFC CONTROLLER

PN7160B1HN/C100

NXP Semiconductors

NFC CONTROLLER

LS1018A

NXP Semiconductors

SYSTEM ON CHIP

SE051C2HQ1/Z01XD

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

PN7161A1EV/C100

NXP Semiconductors

NFC CONTROLLER

PN7161A1HN/C100

NXP Semiconductors

NFC CONTROLLER

MIMX8DL1AVNFZBA

NXP Semiconductors

SoC

BALL

388

SQUARE

PLASTIC/EPOXY

YES

BOTTOM

1.7 mm

15 mm

40

260

15 mm

CMOS

S-PBGA-B388

3

SE051W2HQ1/Z019TZ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

260

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

1

PN7160A1EV/C100

NXP Semiconductors

NFC CONTROLLER

SE051W2HQ1/Z019T

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

PN7160B1EV/C100

NXP Semiconductors

NFC CONTROLLER

A5000R2HQ1/Z016U

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

LS1023AXE7MQB

NXP Semiconductors

SoC

BALL

621

SQUARE

PLASTIC/EPOXY

YES

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

250

CMOS

S-PBGA-B621

3

e1

MCIMX6S5EVM10ADR

NXP Semiconductors

SoC

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

105 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

NT3H1201W0FTTJ

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

260

1

MIMXRT1041DFP6B

NXP Semiconductors

SYSTEM ON CHIP

MIMXRT1041XFP5B

NXP Semiconductors

SYSTEM ON CHIP

MIMXRT1041DJM6B

NXP Semiconductors

SYSTEM ON CHIP

MIMXRT1042DJM6B

NXP Semiconductors

SYSTEM ON CHIP

MIMXRT1042DFP6B

NXP Semiconductors

SYSTEM ON CHIP

MIMX8DL2AVNFZAB

NXP Semiconductors

SoC

MIMX9301DVUXDAA

NXP Semiconductors

SoC

MIMX9301CVUXDAA

NXP Semiconductors

SoC

MIMX9352DVUXMAA

NXP Semiconductors

SoC

MIMX9311XVWXMAA

NXP Semiconductors

SoC

MIMX8DL3AVNFZAB

NXP Semiconductors

SoC

MIMX9332DVUXMAA

NXP Semiconductors

SoC

MIMX8DL1AVNFZAB

NXP Semiconductors

SoC

MIMX8SL1AVNFZAB

NXP Semiconductors

SoC

MIMX9312XVWXMAA

NXP Semiconductors

SoC

MIMX9302CVUXDAA

NXP Semiconductors

SoC

MIMX9332XVUXMAA

NXP Semiconductors

SoC

MIMX9351CVUXMAA

NXP Semiconductors

SoC

MIMX8DL1CVNFZAB

NXP Semiconductors

SoC

MIMX9331XVUXMAA

NXP Semiconductors

SoC

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.