NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3		e1
MIMXRT1062CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3		e1
MIMXRT1062CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
MIMXRT1062CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
MFRC52202HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1176CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX287CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS		1.45 V		.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX535DVV1C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V	0.9/1.25,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS		1.25 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e2
MIMX8MM6DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
P82B715TD,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V		SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm		30	260	4.9 mm	BIPOLAR		5 V		1.27 mm	R-PDSO-G8	1	Not Qualified	e4
PN5321A3HN/C106,55	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD				30	260			150 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N40	2	Not Qualified	e4
MIMX8MQ6DVAJZAB	NXP Semiconductors	SoC															TIN SILVER					40	260								3		e2
MCIMX535DVV1CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V	0.9/1.25,1.3	GRID ARRAY, HEAT SINK/SLUG	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS		1.25 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e2
MIMXRT1064CVJ5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3
MFRC52202HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3
MIMX8MM6DVTLZAAR	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
SE050C2HQ1/Z01SDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20	1		e4
MCIMX6Q6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6Q6AVT10ADR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3
MCIMX7D5EVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	105 Cel	-20 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS		1.225 V		.75 mm	S-PBGA-B541	3
MIMXRT1021CAG4A	NXP Semiconductors	SoC	INDUSTRIAL														TIN					40	260								3		e3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6Y2CVM08AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
MIMXRT1052CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE	40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3		e1
MIMX8MQ6DVAJZAA	NXP Semiconductors	SoC																					260								3
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS		1.1 V		.8 mm	S-PBGA-B609	3		e2
MFRC52201HN1,115	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MCIMX6Q7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MIMXRT117FCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm				14 mm	CMOS				.8 mm	S-PBGA-B289
MIMXRT1052CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3
MCIMX6Q5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MCIMX6S7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MM5DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MIMXRT1021CAF4B	NXP Semiconductors	SoC																				40	260								3
MCIMX6Y2DVM09AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		1.275 V		.8 mm	S-PBGA-B289	3		e1
SE050C1HQ1/Z01SCZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20	1		e4
MIMX8MN2CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER					40	260								3		e2
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel	-20 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS		1.225 V		.4 mm	S-PBGA-B488	3
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
PN7150B0HN/C11002Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	6 mm		30	260	6 mm	CMOS		1.8 V		.5 mm	S-XQCC-N40	3		e4
MCIMX6Y2CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
MIMXRT1051CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
MIMXRT1064DVL6BR	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	95 Cel	0 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.