NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS		1.45 V		.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS		1.1 V		.8 mm	S-PBGA-B529	3		e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS				.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS				.8 mm	S-PBGA-B400	3		e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS				.65 mm	S-PBGA-B400	3		e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MFRC53101T/0FE,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			3.3/5,5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL				30	250			150 mA		Other Microprocessor ICs	1.27 mm	R-PDSO-G32	1	Not Qualified	e4
MIMX8MN3CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP																TIN SILVER					40	260								3		e2
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS		3.3 V			S-XQCC-N48	3		e4
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER		1.7 V	95 Cel	-40 Cel		QUAD	.5 mm	1.6 mm			260	1.6 mm	CMOS					S-PQCC-N8	1
JN5169-001-M06-2Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																						240								3
MCIMX257DJM4A,557	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	70 Cel	-20 Cel		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			17 mm	CMOS		1.45 V		.8 mm	S-PBGA-B400
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS		1.45 V		.8 mm	S-PBGA-B289	3
MCIMX6D5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6X2EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS				.8 mm	S-PBGA-B400	3		e1
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS				.8 mm	S-PBGA-B529	3		e1
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS		.95 V		.5 mm	S-PBGA-B306	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS		1.1 V		.8 mm	S-PBGA-B609	3
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3
S32G233AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																				40	260								3
SE051A2HQ1/Z01XEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm			260	3 mm	CMOS		1.8 V		.4 mm	S-XQCC-N20	1
TDA8035HN/C1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel		QUAD	1 mm	5 mm			260	5 mm	CMOS	220 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MC13211	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM	1 mm	9 mm		30	250	9 mm	CMOS		2.7 V		.5 mm	S-PBGA-B71	3	Not Qualified	e4
MC68302EH16CB1	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK	SPQFP132,1.1SQ		70 Cel	0 Cel	TIN	QUAD				40	260		CMOS			Other uPs/uCs/Peripheral ICs	.635 mm	S-PQFP-G132	3	Not Qualified	e3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS		1.45 V		.8 mm	S-PBGA-B289	3
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MIMX8MQ5DVAJZAA	NXP Semiconductors	SoC																						260								3
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS		1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e2
NT3H1101W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER		1.7 V	95 Cel	-40 Cel		QUAD	.5 mm	1.6 mm			260	1.6 mm	CMOS					S-PQCC-N8	1
NT3H1101W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					NOT SPECIFIED	260								1
NT3H2211W0FTT	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.67 V	105 Cel	-40 Cel		DUAL	1.1 mm	3 mm				3 mm	CMOS		1.8 V		.65 mm	S-PDSO-G8
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
TEA1791T/N1/G,118	NXP Semiconductors			GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			20	SMALL OUTLINE	SOP8,.25					DUAL									20 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G8		Not Qualified
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES							105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm		30	250	21 mm	CMOS				.8 mm	S-PBGA-B621	3		e1
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MFEV710,599	NXP Semiconductors
NT3H1101W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm	1.6 mm				1.6 mm	CMOS				.5 mm	S-PQCC-N8	1		e4
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm				19 mm	CMOS		1.1 V		.8 mm	S-PBGA-B529
MCIMX27LVOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	17 mm	CMOS		1.45 V		.65 mm	S-PBGA-B404	3	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.