NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

P5CC080XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

P5CD020XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-X

Not Qualified

SAA7385GP

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

128

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

FLATPACK

4.5 V

70 Cel

0 Cel

QUAD

CMOS

5 V

R-PQFP-G128

Not Qualified

T1014NSNC4MNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

S32G233AAAK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

T1014NXE7KNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

S32G234MSAK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

P40C040X85

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

MICROELECTRONIC ASSEMBLY

4.5 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 1.62 V

CMOS

5 V

X-XXMA-N8

e4

935265527557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

ALSO REQUIRES 5V SUPPLY

CMOS

3.3 V

R-PQFP-G64

Not Qualified

TDA8026ET/C2/S1,15

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

Not Qualified

T1014NSN7PQA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

UDA1325H06B

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

3.2 mm

14 mm

ALSO REQUIRES 5V SUPPLY

20 mm

CMOS

3.3 V

1 mm

R-PQFP-G64

Not Qualified

935274733118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PNX1500

NXP Semiconductors

TDA8002BT/3/C2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

SM912F634DV2AP

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935287502118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

85 Cel

-25 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

TDA8002BT/3/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

12 mA

5 V

1.27 mm

R-PDSO-G28

Not Qualified

P5CD081XE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

e4

T1014NXEC4KNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

MF0ICU1101W/V1D,00

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD012UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

T1014NXNC4KQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

STDC2150

NXP Semiconductors

P16WX064AEW/XXX

NXP Semiconductors

P5CC080TS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

1.8/5

SMALL OUTLINE

SSOP20,.25

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

.635 mm

R-PDSO-G20

Not Qualified

TDA8002BT/5/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

9 mA

5 V

1.27 mm

R-PDSO-G28

Not Qualified

SAA7380GP

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

TIN

QUAD

ALSO REQUIRES 5V SUPPLY

CMOS

3.3 V

R-PQFP-G80

Not Qualified

e3

T1014NSEC4KNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P5CC073UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

P5CC144HN

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1.8/5

CHIP CARRIER

LCC32,.2SQ,20

1.62 V

85 Cel

-25 Cel

QUAD

CMOS

1.8 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

P5CD051X0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

P5CD080X0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

S32G254ASAK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

PN5472A2EV/C20803

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

49

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.3 V

85 Cel

-30 Cel

BOTTOM

1 mm

4 mm

4.3 mm

CMOS

3.6 V

.5 mm

R-PBGA-B49

TDA8026ET/C2,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

30

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

e1

P8RF6008AEV/0XXCX

NXP Semiconductors

S32G234MAAK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

P60D080PA6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

IT ALSO OPERATES WITH 3V AND 5V SUPPLY

CMOS

1.8 V

X-XUUC-N

T1024NSE7PNA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

S32G274ASBK0VUCT

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

S32G233ASBK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

935262297112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

15 V

IN-LINE

2 V

85 Cel

-40 Cel

DUAL

4.2 mm

7.62 mm

40

250

9.5 mm

BIPOLAR

5 V

2.54 mm

R-PDIP-T8

NOT APPLICABLE

Not Qualified

T1014NXN7KNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

P5CD009EV4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

0

10 MHz

CMOS

1.8 V

UART

X-XUUC-N

Not Qualified

P5CD040X1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

XC33395DWB

NXP Semiconductors

P5CD080XI

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-X

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.