NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

935248340112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

2.7 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

ALSO REQUIRES 5V SUPPLY

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

P5CD021XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

e4

P5CC081UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

P40C072X61

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

MICROELECTRONIC ASSEMBLY

4.5 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 1.62 V

CMOS

5 V

X-XXMA-N8

e4

T1014NXEC4KQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

TDA8026ET/C2,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

P40C012U15

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

UNCASED CHIP

2.7 V

85 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

SL3FCS1001FV/DH,11

NXP Semiconductors

MC33991DHR2

NXP Semiconductors

P5CD040

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

SL2ICS5301EW/V7

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

WAFER

Other Microprocessor ICs

Not Qualified

SL2FCS5401EV/DH

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

FLIP CHIP

Other Microprocessor ICs

Not Qualified

TDA8007BHL/C2,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

SILVER

QUAD

1.6 mm

7 mm

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e4

MF1S5037DUA,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD081A4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

THROUGH-HOLE

4

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

ALSO OPERATES AT 3V, 5V SUPPLY

35 mm

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-T4

Not Qualified

TEA1792T/N1,118

NXP Semiconductors

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE

SOP8,.25

DUAL

260

20 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

1

Not Qualified

T1014NSE7PNA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P60D080PU75

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

IT ALSO OPERATES WITH 3V AND 5V SUPPLY

CMOS

1.8 V

X-XUUC-N

T1014NSNC4KNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

TDA8004AT

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

2.7 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

ALSO REQUIRES 5V SUPPLY

260

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

S32G233AABK0VUCT

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

MPC17510MTBL

NXP Semiconductors

P5CN081TS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.62 V

85 Cel

-25 Cel

DUAL

1.5 mm

4.4 mm

ALSO OPERATES AT 3V, 5V SUPPLY

6.5 mm

CMOS

1.8 V

.65 mm

R-PDSO-G20

MPXY8510DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

P5CD012A6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X

Not Qualified

TDA8002U/5/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

28

DIE

UNSPECIFIED

UNSPECIFIED

YES

6.5 V

UNCASED CHIP

85 Cel

-25 Cel

UPPER

CMOS

9 mA

5 V

X-XUUC-N28

Not Qualified

TDA8002CT/C/C1,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

3

Not Qualified

e4

TEA1792ATS/1,115

NXP Semiconductors

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

DUAL

260

1.2 mA

20 V

Other uPs/uCs/Peripheral ICs

.95 mm

R-PDSO-G6

1

Not Qualified

XPC855TZP80

NXP Semiconductors

TDA8002AT/3/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

12 mA

5 V

1.27 mm

R-PDSO-G28

Not Qualified

TDA8002U/3/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

28

DIE

UNSPECIFIED

UNSPECIFIED

YES

6.5 V

UNCASED CHIP

3 V

85 Cel

-25 Cel

UPPER

CMOS

12 mA

5 V

X-XUUC-N28

Not Qualified

T1014NXEC4MQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P5CD016UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

TDA8002G/3/C2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-PQFP-G32

Not Qualified

T1024NXEC4PQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

935265527518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

ALSO REQUIRES 5V SUPPLY

CMOS

3.3 V

R-PQFP-G64

Not Qualified

PPC17511EV

NXP Semiconductors

P5CN080

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

P60D080PX1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

IT ALSO OPERATES WITH 3V AND 5V SUPPLY

CMOS

1.8 V

X-XUUC-N

P5CD080UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

S32G274ASAK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

P5CD080

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

TDA8002CGB-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

40

260

5 mm

CMOS

3.3 V

.5 mm

S-PQFP-G32

Not Qualified

P5CD020UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

T1014NSN7KQA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

P40C072X60

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

MICROELECTRONIC ASSEMBLY

4.5 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 1.62 V

CMOS

5 V

X-XXMA-N8

P5CC040

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

T1014NSE7KQA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.