NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

P5CD051XS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

TDA8002G/3/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

3 V

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

5 mm

CMOS

12 mA

5 V

.5 mm

S-PQFP-G32

Not Qualified

935265527551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

ALSO REQUIRES 5V SUPPLY

CMOS

3.3 V

R-PQFP-G64

Not Qualified

TDA8002G/5/C1-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

5 mm

CMOS

9 mA

5 V

.5 mm

S-PQFP-G32

Not Qualified

S32G233ASBK0VUCT

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

P5CN144

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

SDIO101AIHR

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

P5CC081TS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.62 V

85 Cel

-25 Cel

DUAL

1.5 mm

4.4 mm

ALSO OPERATES AT 3V, 5V SUPPLY

6.5 mm

CMOS

1.8 V

.65 mm

R-PDSO-G20

T1014NSNC4MQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1014NSNC4KQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

SLRC61002HN,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

P5CC144XS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

PPC17511EVEL

NXP Semiconductors

UDA1325H/N106

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

3.2 mm

14 mm

ALSO REQUIRES 5V SUPPLY

20 mm

CMOS

3.3 V

1 mm

R-PQFP-G64

Not Qualified

P5CN080UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

P5CD012A4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X

Not Qualified

XPC862PCZP50B

NXP Semiconductors

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA357,19X19,50

0 Cel

BOTTOM

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B357

Not Qualified

S32G234MSBK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

P5CD009EVD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

0

10 MHz

CMOS

1.8 V

UART

X-XUUC-N8

Not Qualified

S32G274ASBK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

T1014NSE7PQA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

P5CC036EV0/TXXX

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

PLASTIC/EPOXY

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

NHS3100

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.72 V

85 Cel

-40 Cel

QUAD

1 mm

4 mm

4 mm

CMOS

3 V

.5 mm

S-PQCC-N24

TDA8002AT/5/C2-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

4.5 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G28

Not Qualified

S32G233ASBK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

P5CN081HN

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1.8/5

CHIP CARRIER

LCC32,.2SQ,20

1.62 V

85 Cel

-25 Cel

QUAD

5 mm

ALSO OPERATES AT 3V, 5V SUPPLY

5 mm

CMOS

1.8 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

P5CN081UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

T1024NXE7MQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

TDA8007BHL/C2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

Not Qualified

TDA8002AT/3/C1-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

12 mA

5 V

1.27 mm

R-PDSO-G28

Not Qualified

935263513557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

FLATPACK

3 V

70 Cel

0 Cel

QUAD

3.2 mm

14 mm

ALSO REQUIRES 5V SUPPLY

20 mm

CMOS

3.3 V

1 mm

R-PQFP-G64

Not Qualified

P40C072X84

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

MICROELECTRONIC ASSEMBLY

4.5 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 1.62 V

CMOS

5 V

X-XXMA-N8

S32G274ASAK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

SL2ICS1101DW/V7,00

NXP Semiconductors

MICROPROCESSOR CIRCUIT

DIE OR CHIP

Other Microprocessor ICs

Not Qualified

T1024NXN7MNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1024NXNC4PQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P8RF6008AEV/0XXBX

NXP Semiconductors

SL3FCS1001DV/DH

NXP Semiconductors

QFM-2202

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

47

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

105 Cel

-40 Cel

UNSPECIFIED

CMOS

3.3 V

R-XXMA-N47

S32G234MSAK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

T1024NSN7MNA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P5CC072EV0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

0

10 MHz

CMOS

1.8 V

UART

X-XUUC-N8

Not Qualified

T1014NXE7PQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

935248340113

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

2.7 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

ALSO REQUIRES 5V SUPPLY

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

SL3S1204FUD/BG

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

4

QCCN

RECTANGULAR

UNSPECIFIED

CHIP CARRIER

85 Cel

-40 Cel

GOLD

UPPER

CMOS

R-XUCC-N4

e4

TDA8002CG/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP32,.28SQ,20

3 V

85 Cel

-25 Cel

MATTE TIN

QUAD

1.6 mm

5 mm

5 mm

CMOS

140 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G32

3

Not Qualified

e3

NHS3152UK

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.54 mm

2.51 mm

2.51 mm

CMOS

3.3 V

.4 mm

S-PBGA-B25

P5CD051A6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

THROUGH-HOLE

6

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

ALSO OPERATES AT 3V, 5V SUPPLY

35 mm

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-T6

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.