NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MIMX8MN4CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP																TIN SILVER					40	260							3		e2
MCIMX253DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B256		Not Qualified
LH7A404N0F000B3	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	260				Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324	3	Not Qualified	e1
MC68302CAG16VC	NXP Semiconductors		INDUSTRIAL	GULL WING	144	QFP	SQUARE	CERAMIC	YES			5	FLATPACK	QFP144,.87SQ,20		85 Cel	-40 Cel	TIN	QUAD				40	260		CMOS	5 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-XQFP-G144	3	Not Qualified	e3
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX285AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100	1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX503CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	17 mm	CMOS	1.225 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX508CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	13 mm	CMOS	1.225 V		.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX6D5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS	1.4 V		.4 mm	S-PBGA-B569	3		e1
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS	1.4 V		.4 mm	S-PBGA-B569	3		e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
SFR4310E1MAE40	NXP Semiconductors		AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	FLATPACK	QFP64,.47SQ,20		125 Cel	-40 Cel	TIN	QUAD				40	260		CMOS		Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G64	3	Not Qualified	e3
T1024NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3		e1
SL3S4011FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.7 V			CHIP CARRIER, VERY THIN PROFILE		1.5 V	85 Cel	-40 Cel		QUAD	.5 mm	1.6 mm				1.6 mm	CMOS			.5 mm	S-PQCC-N8	1
P8RF6005AEV/0XXBX	NXP Semiconductors
P5CD080A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO				MICROELECTRONIC ASSEMBLY						DUAL							CMOS				R-XDMA-X		Not Qualified
PPC17529EVEL	NXP Semiconductors
T1024NSEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	1 V		.8 mm	S-PBGA-B780
MF1S7035DUB,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER											WAFER		70 Cel	-25 Cel											Other Microprocessor ICs				Not Qualified
935248340518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		2.7 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm	ALSO REQUIRES 5V SUPPLY			17.9 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G28
XPC17517DTB	NXP Semiconductors
T1014NXEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	1 V		.8 mm	S-PBGA-B780
T1024NXNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	1 V		.8 mm	S-PBGA-B780
P5CC144UA	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES				UNCASED CHIP						UPPER							CMOS				R-XUUC-N		Not Qualified
PV912NE812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm				14 mm	CMOS	3.3 V		.5 mm	S-PQFP-G100
S32G233AABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL																				40	260							3
P5DF072EHN/T0PD4090	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3,5	CHIP CARRIER	LCC32,.2SQ,20					QUAD									Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
P5CC073TS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V			SMALL OUTLINE		1.62 V	85 Cel	-25 Cel		DUAL							CMOS	1.8 V			R-PDSO-G20
P5CD144A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS		Other Microprocessor ICs		R-XDMA-X		Not Qualified
P5CC081XS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	1		UNSPECIFIED	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY				CMOS	1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified
TDA8002G/3/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V			FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-25 Cel		QUAD	1.6 mm	5 mm				5 mm	CMOS	3.3 V		.5 mm	S-PQFP-G32		Not Qualified
P5CD041X1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY				CMOS	1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.