NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MIMXRT1021CAG4B	NXP Semiconductors	SoC																					40	260								3
MIMXRT1021CAF4A	NXP Semiconductors	SoC	INDUSTRIAL															TIN					40	260								3		e3
MIMXRT1061CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3		e1
MIMXRT1051CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3		e1
MCIMX6Q6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6U7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6S7CVM08ACR	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		40	260	19 mm	CMOS		1 V		.8 mm	S-PBGA-B525	3		e1
MIMXRT106FCVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS				.65 mm	S-PBGA-B196	3
PN7150B0HN/C11002E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	6 mm		30	260	6 mm	CMOS		1.8 V		.5 mm	S-XQCC-N40	3		e4
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX257CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS		1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
SE051C2HQ1/Z01XDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm			260	3 mm	CMOS		1.8 V		.4 mm	S-XQCC-N20	1
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS		.95 V		.5 mm	S-PBGA-B306	3
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE			10 mm	CMOS				.65 mm	S-PBGA-B196
MIMX8MM1CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		.95 V		.5 mm	S-PBGA-B486	3		e2
NT3H2111W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.67 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm	1.6 mm		30	260	1.6 mm	CMOS		1.8 V		.5 mm	S-PQCC-N8	1		e4
PN7150B0HN/C11006Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel		QUAD	1 mm	6 mm			260	6 mm	CMOS		1.8 V		.5 mm	S-XQCC-N40	3
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS		1.1 V		.8 mm	S-PBGA-B529	3		e2
SE050B2HQ1/Z01SFZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20	1		e4
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MM3DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MIMX8MM3CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		.95 V		.5 mm	S-PBGA-B486	3		e2
MIMX8MN5DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MIMXRT1061CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
NHS3100/A1Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																						260								3
MCIMX6U5DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			100 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1061CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS				.8 mm	S-PBGA-B196	3		e2
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel	0 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS		1.225 V		.75 mm	S-PBGA-B541	3
MCIMX6Y2DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
MCIMX6U5DVM10ACR	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6Q5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6G3CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3		e1
TDA8035HN/C1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	5 mm		30	260	5 mm	CMOS	220 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified	e4
PN7150B0HN/C11006E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel		QUAD	1 mm	6 mm			260	6 mm	CMOS		1.8 V		.5 mm	S-XQCC-N40	3
MCIMX6Q7CVT08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
MIMXRT1042XJM5B	NXP Semiconductors	SYSTEM ON CHIP
PN7120A0EV/C10801Y	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM				30	260				1.8 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PBGA-B49	3	Not Qualified	e1
NT3H2111W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																NICKEL PALLADIUM GOLD					30	260								1		e4
MCIMX6U8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.