NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XPC17529EPR2

NXP Semiconductors

T1024NSNC4MNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

TDA8029HL/C206,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8/5,3/5

FLATPACK

QFP32,.35SQ,32

90 Cel

-40 Cel

QUAD

Other Microprocessor ICs

.8 mm

S-PQFP-G32

Not Qualified

TDA8002CT/C/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

3.3/5

SMALL OUTLINE

SOP28,.4

3 V

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

140 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

Not Qualified

e4

P5CD012UE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

CMOS

R-XUUC-N

Not Qualified

T1024NSEC4PQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

MF1SPLUS8021DA4/03

NXP Semiconductors

SL2S1612FUD,003

NXP Semiconductors

MICROPROCESSOR CIRCUIT

WAFER

Other Microprocessor ICs

Not Qualified

935261652118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

SA56203

NXP Semiconductors

PNX1302EH/G

NXP Semiconductors

S32G234MABK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

P5CC021TS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

1.8/5

SMALL OUTLINE

SSOP20,.25

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

.635 mm

R-PDSO-G20

Not Qualified

P5CC080XS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

P5CD128UE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

CMOS

1.8 V

X-XUUC-N

T1024NXN7KNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

XPC17517DTBR2

NXP Semiconductors

PPC17529EP

NXP Semiconductors

T1014NSEC4KQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

S32G254ASAK0CUCR

NXP Semiconductors

SoC

INDUSTRIAL

MF0ICU1001W/V4D,00

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD021UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

SDIO101AIHRZ

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

85 Cel

-40 Cel

QUAD

.5 mm

5 mm

260

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N60

2

P5CD051UE

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

R-XUUC-N

TDA8007BHL/C3,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

Tin (Sn)

QUAD

1.6 mm

7 mm

30

260

7 mm

CMOS

315 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e3

935272525118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

85 Cel

-25 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.5 mm

S-PQFP-G48

T1024NSN7KQA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

T1014NSN7KNA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

S32G233AAAK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

T1024NXE7PNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

NT2L1011G0DUDV

NXP Semiconductors

XPC17511EP

NXP Semiconductors

88MW322-A0-NXUE/AZ

NXP Semiconductors

SoC

OTHER

260

3

MF0ICU1101W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD081A6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

THROUGH-HOLE

6

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

ALSO OPERATES AT 3V, 5V SUPPLY

35 mm

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-T6

Not Qualified

X-LA1575RDB-PB

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CMOS

XPC17511EVEL

NXP Semiconductors

P5CD081XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

PALLADIUM

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

e4

XPC857TCZP50B

NXP Semiconductors

BALL

357

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY

BGA357,19X19,50

0 Cel

BOTTOM

3.3 V

Other Microprocessor ICs

1.27 mm

S-PBGA-B357

Not Qualified

T1024NSNC4PNA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1014NXNC4MQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

PPC17517DTB

NXP Semiconductors

T1024NXN7KQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

SM912F634DV1AER2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PPC17517DTBR2

NXP Semiconductors

NHS3100UK/A1Z

NXP Semiconductors

MICROPROCESSOR CIRCUIT

260

1

TDA8002AT/3/C2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

P5CD021HN

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1.8/5

CHIP CARRIER

LCC32,.2SQ,20

1.62 V

85 Cel

-25 Cel

QUAD

5 mm

ALSO OPERATES AT 3V, 5V SUPPLY

5 mm

CMOS

1.8 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.