NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
P40C040U15	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		QCCN	UNSPECIFIED	UNSPECIFIED		5.5 V		CHIP CARRIER		4.5 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 1.62 V						CMOS		5 V				X-XUCC-N
TDA8002BT/5/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		4.5 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		5 V			1.27 mm	R-PDSO-G28		Not Qualified
TDA8002G/5/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel	-25 Cel		QUAD	1.6 mm	5 mm						5 mm	CMOS		5 V			.5 mm	S-PQFP-G32		Not Qualified
T1024NXEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
SL2S1402FUD,003	NXP Semiconductors	MICROPROCESSOR CIRCUIT											WAFER																	Other Microprocessor ICs					Not Qualified
T1014NXE7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3		e1
P5CN144HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD									CMOS		1.8 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32		Not Qualified
S32G233AABK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL																					40	260									3
SAA6740A	NXP Semiconductors
P5CD012X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X8		Not Qualified
S32G233ASAK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
UDA1325H	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		FLATPACK		3 V	70 Cel	0 Cel	Tin (Sn)	QUAD			ALSO REQUIRES 5V SUPPLY						CMOS		3.3 V				R-PQFP-G64		Not Qualified	e3
935268131118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		FLATPACK, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		QUAD	1.6 mm	7 mm						7 mm	CMOS		3.3 V			.5 mm	S-PQFP-G48
T1014NXE7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
P5CC021HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD									CMOS		1.8 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32		Not Qualified
T1024NSE7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3		e1
TDA8002C/CD-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified	e4
T1024NXNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
T1024NSNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
PCIMX516AJM6C	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.175 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm				40	260	19 mm	CMOS		1.225 V			.8 mm	S-PBGA-B529	3	Not Qualified	e1
XPC17529EP	NXP Semiconductors
XC33395DWBR2	NXP Semiconductors
TDA8007BHL/C4,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	7 mm					260	7 mm	CMOS	315 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48	1	Not Qualified
P5CD144X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X8		Not Qualified
TDA8002AT/3/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified
T1014NSN7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
T1024NSNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
MF0UL1101DUF,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL										DIE OR CHIP		70 Cel	-20 Cel														Other Microprocessor ICs					Not Qualified
P5CD016XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel	PALLADIUM	UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified	e4
TDA8007BHL/C3	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm						7 mm	CMOS	315 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48	1	Not Qualified	e3
PN5472A2EV/C20804	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm						4.3 mm	CMOS		3.6 V			.5 mm	R-PBGA-B49
P40C012X60	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		2.7 V	85 Cel	-25 Cel		UPPER									CMOS						X-XUUC-N8
TDA8002C/CD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified	e4
P5CD009EV1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER				0	10 MHz				CMOS		1.8 V		UART		X-XUUC-N8		Not Qualified
P5CD041AI	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V				R-XUUC-N
SL3S4011FUG	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	SQUARE	UNSPECIFIED	YES	3.7 V		UNCASED CHIP		1.5 V	85 Cel	-40 Cel		UPPER									CMOS						S-XUUC-N8
88MW322-A0-NXUC/AZ	NXP Semiconductors	SoC	COMMERCIAL																						260									3
PM9Z1J638AM2EPR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	28 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.5 V	125 Cel	-40 Cel		QUAD	.9 mm	7 mm						7 mm	CMOS		6 V			.5 mm	S-XQCC-N48
S32G234MAAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
T1024NSEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
T1014NSE7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3		e1
SL3S4021FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.7 V		CHIP CARRIER		1.5 V	85 Cel	-40 Cel		BOTTOM	.5 mm	1.6 mm						1.6 mm	CMOS		3 V			.5 mm	S-PBCC-N8	1
NHS3152UK/A1Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																							260									1
T1014NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
PNX4103	NXP Semiconductors
P7SC073AEW/XXX	NXP Semiconductors
P40C012X85	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		2.7 V	85 Cel	-25 Cel		UPPER									CMOS						X-XUUC-N8
PCA9504A-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3.3 V			.5 mm	R-PDSO-G56		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.