NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

T1024NSN7PNA

NXP Semiconductors

SoC

OTHER

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

T1014NXN7PNA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

SLRC61002HN,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

935261652112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

3 V

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

Not Qualified

P5CC145UA

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

CMOS

1.8 V

X-XUUC-N

MF1ICS5005W/V9D

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

WAFER

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD144

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

T1024NSNC4PQA

NXP Semiconductors

SoC

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

0 Cel

BOTTOM

2.07 mm

23 mm

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

P5CC128XS

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

MICROELECTRONIC ASSEMBLY

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

CMOS

1.8 V

X-XXMA-X

TEA1713T/DB/90WNOT

NXP Semiconductors

SLRC40001T/0FE,112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP32,.4

85 Cel

-25 Cel

DUAL

150 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G32

Not Qualified

P5CD144X1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

T1014NXE7KQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

MF0ICU1001W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P5CD051X1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

SAA6714

NXP Semiconductors

SL2MOS5301EV,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Microprocessor ICs

Not Qualified

MF1ICS7001W/V9D

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

WAFER

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

P60D144PA6

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

IT ALSO OPERATES WITH 3V AND 5V SUPPLY

CMOS

1.8 V

X-XUUC-N

TDA8002G/5/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6.5 V

FLATPACK, LOW PROFILE, FINE PITCH

85 Cel

-25 Cel

QUAD

1.6 mm

5 mm

5 mm

CMOS

9 mA

5 V

.5 mm

S-PQFP-G32

Not Qualified

PNX5221

NXP Semiconductors

S32G254AAAK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

P5CD016X0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

3

UNSPECIFIED

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

UNSPECIFIED

ALSO OPERATES AT 3V, 5V SUPPLY

CMOS

1.8 V

Other Microprocessor ICs

X-XXMA-X

Not Qualified

P5CD040XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-X

Not Qualified

P5CD051A4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

THROUGH-HOLE

4

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

ALSO OPERATES AT 3V, 5V SUPPLY

35 mm

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-T4

Not Qualified

PPC17529EPR2

NXP Semiconductors

935267864118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

TDA8002AT/5/C1-T

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

2.65 mm

7.5 mm

17.9 mm

CMOS

9 mA

5 V

1.27 mm

R-PDSO-G28

Not Qualified

MPC17529EL

NXP Semiconductors

P5CD040X0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

8

RECTANGULAR

UNSPECIFIED

NO

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

85 Cel

-25 Cel

DUAL

CMOS

Other Microprocessor ICs

R-XDMA-X8

Not Qualified

SL3S4001FUG

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

DIE

SQUARE

UNSPECIFIED

YES

3.7 V

UNCASED CHIP

1.5 V

85 Cel

-40 Cel

UPPER

CMOS

S-XUUC-N8

SM912F634DV2AER2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

T1014NXN7KQA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

780

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA780,28X28,32

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

23 mm

30

250

23 mm

CMOS

1 V

.8 mm

S-PBGA-B780

3

e1

PPC17511EPR2

NXP Semiconductors

S32G233ASBK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

TDA18204HN/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.47 V

CHIP CARRIER

3.13 V

QUAD

CMOS

3.3 V

S-PQCC-N36

MF1S5035DUD/L,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

PC68EN302RC25

NXP Semiconductors

P8RF6005AEV/0XXCX

NXP Semiconductors

P40C012X84

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

8

DIE

UNSPECIFIED

UNSPECIFIED

YES

5.5 V

UNCASED CHIP

2.7 V

85 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N8

PCF8574A

NXP Semiconductors

MICROPROCESSOR CIRCUIT

CMOS

Not Qualified

MF1S7035DUC,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

WAFER

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

PCA9504ADGG,112

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

14 mm

CMOS

3.3 V

.5 mm

R-PDSO-G56

1

Not Qualified

e4

P60D144PX0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1.98 V

UNCASED CHIP

1.62 V

85 Cel

-25 Cel

UPPER

IT ALSO OPERATES WITH 3V AND 5V SUPPLY

CMOS

1.8 V

X-XUUC-N

S32G233ASAK0CUCT

NXP Semiconductors

SoC

INDUSTRIAL

P5CD080XD

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1.98 V

1.8/5

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

1.62 V

85 Cel

-25 Cel

DUAL

CMOS

1.8 V

Other Microprocessor ICs

R-XDMA-X

Not Qualified

PNX0106

NXP Semiconductors

SL3S4001FHK

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

VQCCN

SQUARE

PLASTIC/EPOXY

YES

3.7 V

CHIP CARRIER, VERY THIN PROFILE

1.5 V

85 Cel

-40 Cel

QUAD

.5 mm

1.6 mm

1.6 mm

CMOS

.5 mm

S-PQCC-N8

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.