NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
P5CC080	NXP Semiconductors	MICROPROCESSOR CIRCUIT																										CMOS
88MW320-A0-NAPC/AK	NXP Semiconductors	SoC	COMMERCIAL																							260									3
T1024NXEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
TDA8002AT/5/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		4.5 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		5 V			1.27 mm	R-PDSO-G28		Not Qualified
PM912KS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm						14 mm	CMOS					.5 mm	S-PQFP-G100
P1020NXE2HFB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES		32	1	GRID ARRAY	BGA689,29X29,40		105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm				40	260	31 mm	CMOS		1 V	Microprocessors		1 mm	S-PBGA-B689	3	Not Qualified	800 rpm	e2
P5CC081XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	1		UNSPECIFIED	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel	PALLADIUM	UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified		e4
935263513551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			FLATPACK		3 V	70 Cel	0 Cel		QUAD	3.2 mm	14 mm	ALSO REQUIRES 5V SUPPLY					20 mm	CMOS		3.3 V			1 mm	R-PQFP-G64		Not Qualified
SDIO101IET	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	4 mm						4 mm	CMOS		1.8 V			.4 mm	S-PBGA-B64		Not Qualified
T1014NSEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
S32G234MAAK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL
P60D144PA4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V			UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			IT ALSO OPERATES WITH 3V AND 5V SUPPLY						CMOS		1.8 V				X-XUUC-N
P5CC009EAEV/0XXPX	NXP Semiconductors
TDA8002U/5/C1-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	28	DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V			UNCASED CHIP			85 Cel	-25 Cel		UPPER									CMOS	9 mA	5 V				X-XUUC-N28		Not Qualified
UDA1325PS/N106	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	PIN/PEG	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	3.6 V			IN-LINE, SHRINK PITCH		3 V	70 Cel	0 Cel		DUAL	5.08 mm	15.24 mm	ALSO REQUIRES 5V SUPPLY					38.65 mm	CMOS		3.3 V			1.778 mm	R-PDIP-P42		Not Qualified
T1014NSEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
TDA8002G/3/C1-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V			FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-25 Cel		QUAD	1.6 mm	5 mm						5 mm	CMOS	12 mA	5 V			.5 mm	S-PQFP-G32		Not Qualified
MPXV8510DK016T1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG		1.8 V	125 Cel	-40 Cel		QUAD	2.3 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS		3 V			.65 mm	S-XQCC-N32
P5CD072EV4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	UNSPECIFIED	YES	5.5 V			UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER				0	10 MHz				CMOS		1.8 V		UART		X-XUUC-N		Not Qualified
P5CD144XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL									CMOS		1.8 V	Other Microprocessor ICs			R-XDMA-X		Not Qualified
S32G254AAAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
P40C012X61	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	5.5 V			UNCASED CHIP		2.7 V	85 Cel	-25 Cel		UPPER									CMOS						X-XUUC-N8
NHS3100UK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.72 V	85 Cel	-40 Cel		BOTTOM	.54 mm	2.51 mm						2.51 mm	CMOS		3 V			.4 mm	S-PBGA-B25
PPC17529EV	NXP Semiconductors
MF0ICU1101W/U7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER											DIE OR CHIP		70 Cel	-25 Cel														Other Microprocessor ICs					Not Qualified
TDA8030HL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	4.2 V	85 Cel	-25 Cel		QUAD	1.6 mm	10 mm				40	260	10 mm	CMOS		5 V	Other Microprocessor ICs		.5 mm	S-PQFP-G64		Not Qualified
T1024NSEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
T1024NXEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
P5CC080UA	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES				UNCASED CHIP						UPPER									CMOS						R-XUUC-N		Not Qualified
P5CD080A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X		Not Qualified
TEA1792ATSX	NXP Semiconductors			GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY	YES			20	SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37					DUAL										1.2 mA	20 V	Other Microprocessor ICs		.95 mm	R-PDSO-G6		Not Qualified
T1024NSEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
88MW320-A0-NAPI/AZ	NXP Semiconductors	SoC	INDUSTRIAL																							260									3
P5CD040A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X		Not Qualified
SL2MOS5301EV	NXP Semiconductors	MICROPROCESSOR CIRCUIT						PLASTIC/EPOXY					MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)																	Other Microprocessor ICs					Not Qualified
MF1ICS5007W/V6D	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER											WAFER		70 Cel	-25 Cel														Other Microprocessor ICs					Not Qualified
T1024NSE7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3			e1
TDA8002CT/C/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28	3	Not Qualified		e4
P60D144PU15	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V			UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			IT ALSO OPERATES WITH 3V AND 5V SUPPLY						CMOS		1.8 V				X-XUUC-N
T1014NSN7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3			e1
TDA8002C/BD-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified		e4
XPC17529EVEL	NXP Semiconductors
T1014NXEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
TDA8002U/3/C1-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	28	DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V			UNCASED CHIP		3 V	85 Cel	-25 Cel		UPPER									CMOS	12 mA	5 V				X-XUUC-N28		Not Qualified
P5CD072EVD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V			UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER				0	10 MHz				CMOS		1.8 V		UART		X-XUUC-N8		Not Qualified
P5CC021XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED									CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified
P5CD041A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	4		RECTANGULAR	UNSPECIFIED	NO	1.98 V		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY					35 mm	CMOS		1.8 V	Other Microprocessor ICs			R-XDMA-T4		Not Qualified
T1024NXEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.