NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
T1024NXE7MNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
P5CD016A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	4		RECTANGULAR	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		DUAL			ALSO OPERATES AT 3V, 5V SUPPLY			35 mm	CMOS		1.8 V	Other Microprocessor ICs		R-XDMA-T4		Not Qualified
TDA8031HL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	4.2 V	85 Cel	-25 Cel		QUAD	1.6 mm	10 mm		40	260	10 mm	CMOS		5 V	Other Microprocessor ICs	.5 mm	S-PQFP-G64		Not Qualified
PPC17511EP	NXP Semiconductors
XPC17511EPR2	NXP Semiconductors
P5CD145X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1.98 V		MICROELECTRONIC ASSEMBLY		1.62 V	85 Cel	-25 Cel		DUAL							CMOS		1.8 V			R-XDMA-X
P5CD020UE	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES			UNCASED CHIP						UPPER							CMOS					R-XUUC-N		Not Qualified
T1014NSE7MQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
P5SC036EV0/TXXX	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER					PLASTIC/EPOXY			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel												Other Microprocessor ICs				Not Qualified
T1024NSNC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
S32G274AABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL																			40	260								3
PN65LHN4	NXP Semiconductors		OTHER	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES		1.8/3.3,3	CHIP CARRIER	LCC48,.27SQ,20		85 Cel	-30 Cel		QUAD										Other Microprocessor ICs	.5 mm	S-PQCC-N48		Not Qualified
935267864112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	6.1 mm				14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56	1	Not Qualified	e4
P5CD145UA	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER							CMOS		1.8 V			X-XUUC-N
T1024NSE7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
935261709518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-25 Cel	TIN	QUAD	1.6 mm	5 mm				5 mm	CMOS		3.3 V		.5 mm	S-PQFP-G32	3	Not Qualified	e3
P5CD080UE	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES			UNCASED CHIP						UPPER							CMOS					R-XUUC-N		Not Qualified
TDA8004T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		2.7 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm	ALSO REQUIRES 5V SUPPLY		260	17.9 mm	CMOS		3.3 V		1.27 mm	R-PDSO-G28		Not Qualified
TDA8002CT/A/C1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V	3.3/5	SMALL OUTLINE	SOP28,.4	3 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm				17.9 mm	CMOS	140 mA	3.3 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G28		Not Qualified
TDA8000TD-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V		SMALL OUTLINE		6.7 V	70 Cel	0 Cel		DUAL	2.65 mm	7.5 mm				17.9 mm	CMOS		12 V		1.27 mm	R-PDSO-G28		Not Qualified
PCIMX535DVV1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, FINE PITCH		1.2 V				BOTTOM	1.85 mm	19 mm				19 mm	CMOS		1.25 V		.8 mm	S-PBGA-B529	3	Not Qualified	e2
T1014NXN7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
S32G254ASAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
TDA8002CT/A/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm				17.9 mm	CMOS		3.3 V		1.27 mm	R-PDSO-G28		Not Qualified
P40C040X84	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V		MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 1.62 V				CMOS		5 V			X-XXMA-N8
S32G274ASAK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL
P5CC040XS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X8		Not Qualified
T1024NXE7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
P60D144PX30	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			IT ALSO OPERATES WITH 3V AND 5V SUPPLY				CMOS		1.8 V			X-XUUC-N
P60C080PHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		1.8/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD							CMOS			Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
S32G234MABK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
NHS3152/A1Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					260								3
T1024NSN7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
SFR4310E1MAE40R	NXP Semiconductors		AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		2.5,3.3	FLATPACK	QFP64,.47SQ,20		125 Cel	-40 Cel	TIN	QUAD				40	260		CMOS			Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G64	3	Not Qualified	e3
P40C040U75	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		QCCN	UNSPECIFIED	UNSPECIFIED		5.5 V		CHIP CARRIER		4.5 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 1.62 V				CMOS		5 V			X-XUCC-N
S32G274AAAK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL
TDA8002CG/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	3 V	85 Cel	-25 Cel	TIN	QUAD	1.6 mm	5 mm				5 mm	CMOS	140 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQFP-G32	3	Not Qualified	e3
T1014NSEC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
S32G254AAAK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
TDA8002U/5/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V		UNCASED CHIP		4.5 V	85 Cel	-25 Cel		UPPER							CMOS		5 V			X-XUUC-N		Not Qualified
TZA1042	NXP Semiconductors
P5CD020X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X8		Not Qualified
PM912JS812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm				14 mm	CMOS				.5 mm	S-PQFP-G100
TDA18204HN/C1,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					260								3
UDA1325H-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		FLATPACK		3 V	70 Cel	0 Cel	TIN	QUAD			ALSO REQUIRES 5V SUPPLY				CMOS		3.3 V			R-PQFP-G64		Not Qualified	e3
88MW320-A0-NAPE/AZ	NXP Semiconductors	SoC	OTHER																				260								3
P40C040X60	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V		MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 1.62 V				CMOS		5 V			X-XXMA-N8
SAA7388GPB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK		3 V	70 Cel	0 Cel		QUAD	3.2 mm	14 mm	ALSO REQUIRES 5V SUPPLY			20 mm	CMOS		3.3 V		.8 mm	S-PQFP-G80		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.