NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

935305116518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8548EVJAQJB

NXP Semiconductors

SoC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF1PH2200DA8/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

85 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

HTCM400/EAE,122

NXP Semiconductors

OTHER

27

PLASTIC/EPOXY

5

MICROELECTRONIC ASSEMBLY

MODULE,27LEAD,1

85 Cel

-25 Cel

100 mA

5 V

Other uPs/uCs/Peripheral ICs

Not Qualified

MPC8271CVRTIE

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MF3DH2301DUD/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

85 Cel

-25 Cel

UNSPECIFIED

CMOS

X-XUUC-N

MPC8548VTAVHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

NOT SPECIFIED

NOT SPECIFIED

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

LH79524

NXP Semiconductors

INDUSTRIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA208,16X16,32

85 Cel

-40 Cel

BOTTOM

Other Microprocessor ICs

.8 mm

S-PBGA-B208

Not Qualified

MPC8548EVJATGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MPC8248CZQMIB

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MF1PH2101DA4/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

70 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MC9328MXLDVP15R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

MPC8548EVJATJB

NXP Semiconductors

SoC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

LH7A400N0E000B5

NXP Semiconductors

COMMERCIAL

BALL

256

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA256,16X16,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B256

Not Qualified

935289362118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8360EZUAJDH

NXP Semiconductors

935306933118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL PALLADIUM GOLD

30

260

1

e4

MF3MOD4101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

PLASTIC/EPOXY

YES

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

CMOS

X-PXMA-N

MC68302CRC20

NXP Semiconductors

INDUSTRIAL

132

PLASTIC/EPOXY

NO

5

PGA132,15X15

85 Cel

-40 Cel

CMOS

5 V

Other uPs/uCs/Peripheral ICs

Not Qualified

935319909518

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

21 mm

CMOS

.8 mm

S-PBGA-B624

MPC8548EPXAVGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

LPC55S66JBD100

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

MPC8548ECVTAQGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MM912F634DV2AER2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

18 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

5.5 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

7 mm

40

260

7 mm

CMOS

7 V

.5 mm

S-PQFP-G48

3

e3

MPC8548VJAVHD

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

40

260

29 mm

CMOS

1.1 V

Microprocessors

1 mm

S-PBGA-B783

3

Not Qualified

MPC8360EVVAGFE

NXP Semiconductors

935297798518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935307749012

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8247CZQPIE

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MC9328MXLCVP15

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

13 mm

40

260

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

3

e1

MPC8548ECVTAQGD

NXP Semiconductors

SoC

BALL

783

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

0 Cel

BOTTOM

3.294 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

R-PBGA-B783

MF3ICD2101DUD/05,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

KW45B41Z52AFPBR

NXP Semiconductors

SoC

KW45B41Z83AFPBR

NXP Semiconductors

SoC

KW45B41Z52AFTBR

NXP Semiconductors

SoC

KW45Z41083AFTBT

NXP Semiconductors

SoC

KW45B41Z82AFTBT

NXP Semiconductors

SoC

KW45B41Z83AFTBR

NXP Semiconductors

SoC

KW45Z41083AFTBR

NXP Semiconductors

SoC

KW45Z41052AFPBR

NXP Semiconductors

SoC

KW45B41Z82AFPBR

NXP Semiconductors

SoC

KW45B41Z53AFPBT

NXP Semiconductors

SoC

KW45Z41083AFPBR

NXP Semiconductors

SoC

KW45Z41052AFTBR

NXP Semiconductors

SoC

KW45B41Z53AFTBR

NXP Semiconductors

SoC

KW45B41Z82AFTBR

NXP Semiconductors

SoC

KW45B41Z52AFPBT

NXP Semiconductors

SoC

KW45B41Z53AFPBR

NXP Semiconductors

SoC

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.