NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MPC8548ECPXATGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935319909557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
MPC8548CPXAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935311087528	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN				40	260							3		e3
MC68302PV16	NXP Semiconductors		COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		5	FLATPACK	QFP144,.87SQ,20		70 Cel	0 Cel		QUAD						CMOS	5 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G144		Not Qualified
935319435557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
CLEV663B,699	NXP Semiconductors
MM912F634DV1AER2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	7 mm	40	260	7 mm	CMOS	7 V		.5 mm	S-PQFP-G48	3		e3
JN5179/001Y	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				260							3
MC9328MXLVP15R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	13 mm	40	260	13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225	3		e1
MPC8360EVVADDC	NXP Semiconductors
935341041557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MF1PH4101DUD/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
935361158557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8548PXAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAQGA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MC13211R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM	1 mm	9 mm	30	250	9 mm	CMOS	2.7 V		.5 mm	S-PBGA-B71	3	Not Qualified	e4
935361276557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8548ECVJAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MC68302RC20	NXP Semiconductors		COMMERCIAL		132			PLASTIC/EPOXY	NO		5		PGA132,15X15		70 Cel	0 Cel								CMOS	5 V	Other uPs/uCs/Peripheral ICs				Not Qualified
935313319557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MPC8548VJAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MF3MODH2101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED						CMOS				X-PXMA-N
MF3DH4201DUF/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935297798551	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF3MODH8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED						CMOS				X-PXMA-N
935314256557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
JN5179/001Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				260							3
LH7A400N0E000	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	.8 mm	S-XBGA-B256		Not Qualified
935357612557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MF3DH9200DA4/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MKW21Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel	-40 Cel		QUAD						CMOS	3.3 V			S-XQCC-N48
935340604557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER				30	250							3		e1
MF1PH4131DUD/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
MF1P4201DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
935361137557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8360EVVAGDC	NXP Semiconductors
MPC8360EZUAJFC	NXP Semiconductors
MPC8548EVJAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548ECPXAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935357609557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935311097557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MM912JS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	3.3 V		.5 mm	S-PQFP-G100	3		e3
I.MX31L	NXP Semiconductors
MPC8360EVVAJDH	NXP Semiconductors
MF1PH2231DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
MPC8548CVJATGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MPC8247CZQTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.