NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
935318005557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS				.8 mm	S-PBGA-B624
MKW31Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD				40	260		CMOS		3.3 V			S-XQCC-N48	3		e4
ISP1130DL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	4 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.8 mm	7.5 mm				18.425 mm	CMOS		5 V	Bus Controllers	.635 mm	R-PDSO-G56		Not Qualified	e4
MPC8360EZUADFC	NXP Semiconductors
935293007118	NXP Semiconductors	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	5 mm		30	260	5 mm	CMOS		3.3 V		.5 mm	S-PQCC-N32	1		e4
MPC8548EVJAQJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC68302FC25	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES		5	FLATPACK	SPQFP132,1.1SQ		70 Cel	0 Cel		QUAD							CMOS		5 V	Other uPs/uCs/Peripheral ICs	.635 mm	S-PQFP-G132		Not Qualified
MPC8548CPXATGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e0
935311447518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN SILVER					40	260								3		e2
MPC8548ECVJAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJATGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3D4201DUF/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
LH7A400N0B000B5	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM										Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B256		Not Qualified
935309323557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					30	250								3		e4
MC13226VR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	99	LGA	SQUARE	UNSPECIFIED	YES	3.6 V		GRID ARRAY		2 V	105 Cel	-40 Cel		BOTTOM	1.2 mm	9.5 mm		40	260	9.5 mm	CMOS		2.7 V			S-XBGA-N99	3
JN5169-001-M03-2Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					240								3
MPC8358EZUADDG	NXP Semiconductors
935314905518	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MKW41Z256VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel	-40 Cel		QUAD							CMOS		3.3 V			S-XQCC-N48
MF4SAM3X84/9BA6AUS	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF3D8200DA6/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MCZ33780EGR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	5,9/25	SMALL OUTLINE	SOP16,.4	4.75 V	85 Cel	-40 Cel	TIN	DUAL	2.65 mm	7.5 mm		40	260	10.3 mm	CMOS	23 mA	5 V	Parallel IO Port	1.27 mm	R-PDSO-G16	3	Not Qualified	e3
935316559557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN					40	260								3		e3
935361144557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8548VTAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm		NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548ECPXAQHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8360EZUAGFG	NXP Semiconductors
JN5179/001K	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					260								3
MPC8548ECVJAUHB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548ECVTAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548ECVJAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935361285557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935361143557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404-N0F-092	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM										Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
MPC8548EVJAQHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF1P2101DA4/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
MPC8548EVJAQHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548CVTAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC9328MXLCVP15R2	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	13 mm				13 mm	CMOS		1.8 V		.8 mm	S-PBGA-B225
LH7A404-N0E-092	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM										Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
MC13212R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM	1 mm	9 mm		30	250	9 mm	CMOS		2.7 V		.5 mm	S-PBGA-B71	3	Not Qualified	e4
MPC8548VJAUJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
MM912F634DV2AP	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	TIN	QUAD	1.6 mm	7 mm		40	260	7 mm	CMOS		7 V		.5 mm	S-PQFP-G48	3		e3
MC9328MXLDVM20R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm				14 mm	CMOS		1.8 V		.8 mm	S-PBGA-B256
IW416HN/A1IMP	NXP Semiconductors	SoC																					260								3
935340586557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250								3		e1
935361278557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
MF3D9200DU15/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.