NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MF3DH2300DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	4	DMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		DUAL							CMOS					R-PDMA-N4
MPC8247VRPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548EVJAUJA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC13213	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM	1 mm	9 mm		30	250	9 mm	CMOS		2.7 V		.5 mm	S-PBGA-B71	3	Not Qualified	e4
935316342557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MPC8360EZUAGDH	NXP Semiconductors
MPC8548ECVJAVJA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935320635557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					40	260								3		e4
MPC8548EVJAUJD	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.294 mm	29 mm		40	260	29 mm	CMOS		1.1 V		1 mm	R-PBGA-B783	3
935300281515	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel		QUAD	.5 mm	5 mm				5 mm	CMOS		1.8 V		.5 mm	S-PQCC-N60
MPC8548EVJAUGB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3MOD4101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MC68153L	NXP Semiconductors		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		5	IN-LINE	DIP40,.6		70 Cel	0 Cel		DUAL							MOS	385 mA	5 V	Other uPs/uCs/Peripheral ICs	2.54 mm	R-XDIP-T40		Not Qualified
935314739518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS				.8 mm	S-PBGA-B624
935297046118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE, VERY THIN PROFILE			70 Cel	-25 Cel		DUAL	.5 mm	1.5 mm				2 mm	CMOS				.5 mm	R-PDSO-N4
MPC8360EZUADFE	NXP Semiconductors
935311432518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS				.8 mm	S-PBGA-B624
MPC8248CVRTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM										Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935299782125	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm	1.6 mm		30	260	1.6 mm	CMOS		3 V		.5 mm	R-PQCC-N8	1		e4
935306932118	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL PALLADIUM GOLD					30	260								1		e4
MPC8548ECVJAQHB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8360EVVALDG	NXP Semiconductors
SCIMX536AVV8CR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				40	260								3
MPC8360EVVALFC	NXP Semiconductors
MPC8548ECPXAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3DH9200DA6/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548CVJAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
935334078058	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935361141557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LPC5528JBD100	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
935320635518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					40	260								3		e4
LPC55S69JBD64	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
935291967551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel		QUAD	1 mm	7 mm				7 mm	CMOS		3.3 V		.65 mm	S-PQCC-N33
MPC8358EVVAGDE	NXP Semiconductors
MPC8360EVVADFC	NXP Semiconductors
MPC8548ECVJATGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
ISP3582	NXP Semiconductors
MPC8548EPXAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVTAUHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935307865515	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548ECVJAUGA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8272VRPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548CVJAUJA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
MPC8271VRMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935361272557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8548ECVJATJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
IW416UK/A1IZ	NXP Semiconductors	SoC																					260								1
MPC8548ECPXAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.