NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MPC8360EVVAJFC	NXP Semiconductors
MPC8548EVJAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
ISP1130N	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	56	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	5	IN-LINE, SHRINK PITCH	SDIP56,.6	4 V	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	5.08 mm	15.24 mm			52 mm	CMOS	5 V	Bus Controllers	1.778 mm	R-PDIP-T56		Not Qualified	e3/e4
MF1P2231DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
935317648518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
JN5169-001-M00-2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	27		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2 V	85 Cel	-40 Cel		UNSPECIFIED		16 mm			30 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N27
MF3DA200DA6/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935361153557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MF3D8301DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UNSPECIFIED						CMOS				X-XUUC-N
LPC55S26JBD64	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
MPC8271ZQTIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM						CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935361274557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935338883557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER				30	250							3		e1
MF3DH8301DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UNSPECIFIED						CMOS				X-XUUC-N
MPC8548EVJATGA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548ECVTATHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935291297515	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel		QUAD	.5 mm	5 mm			5 mm	CMOS	1.8 V		.5 mm	S-PQCC-N60
935316559528	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN				40	260							3		e3
MF1P4131DUD/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
MPC8548CVJATGA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MF3ICDH2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER						CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MM912IP812AMAFR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		4.7 V	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS			.5 mm	S-PQFP-G100	3		e3
MF1PH4231DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER						CMOS				X-XUUC-N
MPC8360EVVAJDE	NXP Semiconductors
MF1P2131DA6/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
MF1PH2230DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
MC92307CI	NXP Semiconductors
LH7A400N0B000	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	1 mm	S-PBGA-B256		Not Qualified
935311067557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548EVJATJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8247CVRPIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935289361118	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL PALLADIUM GOLD				30	260							1		e4
MF3DH8200DA4/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF1PH4230DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
MPC8360EVVALDC	NXP Semiconductors
LH79525	NXP Semiconductors		INDUSTRIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	FLATPACK	QFP176,.87SQ,16		85 Cel	-40 Cel		QUAD								Other Microprocessor ICs	.4 mm	S-PQFP-G176		Not Qualified
935386988472	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm	30	260	3 mm	CMOS	1.8 V		.4 mm	S-PQCC-N20	1		e4
935313421518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD				30	250							3		e4
MPC8548CVJAUJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MPC8548EPXAQHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935307303515	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935313259557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD				40	260							3		e4
MPC8272ZQTIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM						CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935320155518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
MF1PH2200DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
935313422557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD				30	250							3		e4
935361145557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935311627557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.