NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MKW31Z512VHT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER

1.71 V

105 Cel

-40 Cel

NICKEL GOLD

QUAD

40

260

CMOS

3.3 V

S-XQCC-N48

3

e4

MPC8548CVJATGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e2

935305116515

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935357621557

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

21 mm

CMOS

.8 mm

S-PBGA-B624

935293007157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

85 Cel

-25 Cel

QUAD

1 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-PQCC-N32

MPC8548ECVJAQJC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF1PH4101DA4/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

70 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MPC8271ZQMIB

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MF3DH2200DA6/01

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MC9S12XEP100

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

1.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

935324621518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL GOLD

40

260

3

e4

935338887557

NXP Semiconductors

SYSTEM ON CHIP

TIN SILVER COPPER

30

250

3

e1

MF3D9200DU75/02

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935305116557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

LH7A404-N0E-000

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other Microprocessor ICs

.8 mm

S-XBGA-B324

Not Qualified

MPC8548ECPXATJC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3DH4200DA4/01

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935357618557

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

21 mm

CMOS

.8 mm

S-PBGA-B624

MF3D2201DUD/01

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8360EZUALFC

NXP Semiconductors

MF1P2101DA6/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

70 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MKW31Z512VHT4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER

1.71 V

105 Cel

-40 Cel

NICKEL GOLD

QUAD

40

260

CMOS

3.3 V

S-XQCC-N48

3

e4

LPC55S69JEV98

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

MCZ33781EKR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5,9/25

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

SSOP32,.4

4.75 V

90 Cel

-40 Cel

TIN

DUAL

2.65 mm

7.5 mm

40

260

11 mm

CMOS

61 mA

5 V

Parallel IO Port

.65 mm

R-PDSO-G32

3

Not Qualified

e3

LH7A404N0F092B3

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

260

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

3

Not Qualified

e1

MPC8548ECVTAQJC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3DH8300DA4/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

4

DMA

RECTANGULAR

PLASTIC/EPOXY

NO

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

DUAL

CMOS

R-PDMA-N4

935309347557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

TIN

40

260

3

e3

MPC8548ECVJAQHA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3ICD8101DUD/01

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

WAFER

70 Cel

-25 Cel

UPPER

CMOS

30 mA

Other Microprocessor ICs

X-XUUC-N

Not Qualified

MKW31Z512CAT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT

40

260

1

MPC8248CVRPIE

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

LH7A404N0E000B0A

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

MKW21Z256VHT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER

1.71 V

105 Cel

-40 Cel

QUAD

CMOS

3.3 V

S-XQCC-N48

LH7A400N0B000B3A

NXP Semiconductors

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

GRID ARRAY

BGA256,16X16,40

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B256

Not Qualified

935317979557

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MC92600ZTB

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE

1.65 V

70 Cel

0 Cel

BOTTOM

1.6 mm

15 mm

30

220

15 mm

CMOS

1.8 V

1 mm

S-PBGA-B196

3

Not Qualified

935319825557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MF3MODH2101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

PLASTIC/EPOXY

YES

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

CMOS

X-PXMA-N

935373763118

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

OTHER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1.98 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,32

1.62 V

85 Cel

-25 Cel

DUAL

1 mm

4 mm

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

4 mm

CMOS

1.8 V

.8 mm

S-PDSO-N8

ISP1132N

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

56

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE, SHRINK PITCH

4 V

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

5.08 mm

15.24 mm

52 mm

CMOS

5 V

1.778 mm

R-PDIP-T56

Not Qualified

e3/e4

MC68302PV20

NXP Semiconductors

COMMERCIAL

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP144,.87SQ,20

70 Cel

0 Cel

QUAD

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PQFP-G144

Not Qualified

MPC8248VRMIB

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MPC8548ECVJAUJA

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

935357605557

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MPC8548VJAQGD

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

40

260

29 mm

CMOS

1.1 V

Microprocessors

1 mm

S-PBGA-B783

3

Not Qualified

e2

935323202557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MCZ33781EK

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5,9/25

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

4.75 V

90 Cel

-40 Cel

TIN

DUAL

2.65 mm

7.5 mm

40

260

11 mm

CMOS

61 mA

Parallel IO Port

.65 mm

R-PDSO-G32

3

Not Qualified

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.