NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
KW45B41Z52AFTBT	NXP Semiconductors	SoC
KW45Z41082AFTBR	NXP Semiconductors	SoC
KW45Z41053AFTBR	NXP Semiconductors	SoC
KW45B41Z53AFTBT	NXP Semiconductors	SoC
KW45Z41082AFPBR	NXP Semiconductors	SoC
KW45Z41053AFTBT	NXP Semiconductors	SoC
KW45Z41082AFTBT	NXP Semiconductors	SoC
KW45Z41053AFPBR	NXP Semiconductors	SoC
KW45Z41052AFPBT	NXP Semiconductors	SoC
KW45B41Z83AFTBT	NXP Semiconductors	SoC
KW45Z41082AFPBT	NXP Semiconductors	SoC
KW45Z41083AFPBT	NXP Semiconductors	SoC
KW45Z41052AFTBT	NXP Semiconductors	SoC
KW45B41Z83AFPBT	NXP Semiconductors	SoC
KW45Z41053AFPBT	NXP Semiconductors	SoC
935311447557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN SILVER					40	260							3		e2
935311067528	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935314651557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935320155557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS			.8 mm	S-PBGA-B624
935302842125	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel		QUAD	.5 mm	1.6 mm				1.6 mm	CMOS			.5 mm	S-PQCC-N8
935334077058	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MC13224V	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	99	LGA	SQUARE	UNSPECIFIED	YES	3.6 V		GRID ARRAY		2 V	105 Cel	-40 Cel		BOTTOM	1.2 mm	9.5 mm		40	260	9.5 mm	CMOS	2.7 V			S-XBGA-N99	3
MC68302EH25CB1	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK	SPQFP132,1.1SQ		70 Cel	0 Cel	TIN	QUAD				40	260		CMOS		Other uPs/uCs/Peripheral ICs	.635 mm	S-PQFP-G132	3	Not Qualified	e3
LH7A404-N0F-000	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel		BOTTOM									Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
MPC8548CVTAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm		NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935361283557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MF3DA200DU15/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8360EVVADFE	NXP Semiconductors
935314935557	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935314748518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS			.8 mm	S-PBGA-B624
935386985472	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	90 Cel	-25 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS	1.8 V		.4 mm	S-PQCC-N20	1		e4
MF1PH4201DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER							CMOS				X-XUUC-N
MPC8548ECVJAUJD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-PBGA-B783	3	Not Qualified	e2
MPC8271VRPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548ECVTAVHD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MF3DA200DU75/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF3D8300DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	4	DMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		DUAL							CMOS				R-PDMA-N4
MPC8548EVJAVHB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548CVJAQGD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-PBGA-B783	3	Not Qualified
MPC8548EVJAQJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
LPC55S26JEV98	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
MPC8548EVJAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8360EVVADFG	NXP Semiconductors
MPC8548EPXATJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8360EZUAGDE	NXP Semiconductors
935289363118	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548CPXAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e0
MPC8548ECVJAVGA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.