NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MPC8247CVRMIBA	NXP Semiconductors	SoC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e2
LH7A400N0G076	NXP Semiconductors		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		85 Cel	-40 Cel		BOTTOM									Other Microprocessor ICs	1 mm	S-PBGA-B256		Not Qualified
LPC55S66JBD64	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
MPC8272VRTIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MC13890	NXP Semiconductors
935313422518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					30	250							3		e4
MF3D9200DA6/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8360EZUAJFG	NXP Semiconductors
935289365118	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL PALLADIUM GOLD					30	260							1		e4
MF1PH4200DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED							CMOS				R-XXMA-N
935311446557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MC9328MXLDVM20	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	14 mm		40	260	14 mm	CMOS	1.8 V		.8 mm	S-PBGA-B256	3
MF3MOD2101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
935369502023	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	90 Cel	-40 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			2.06 mm	CMOS	1.8 V		.5 mm	R-PBGA-B12
LH79524N0E100A0	NXP Semiconductors		INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA208,16X16,32		85 Cel	-40 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B208		Not Qualified
MF3DHA200DU15/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
EM773FHN33/301	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel		QUAD	1 mm	7 mm				7 mm	CMOS	3.3 V		.65 mm	S-PQCC-N33		Not Qualified
MPC8548EVJATJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548ECVJAQGD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-PBGA-B783	3	Not Qualified	e2
935314904518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN SILVER					40	260							3		e2
MF1P4200DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED							CMOS				R-XXMA-N
MPC8548CVJAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MPC8248CZQTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM									Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MCZ33781R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		SMALL OUTLINE, SHRINK PITCH		4.75 V	90 Cel	-40 Cel		DUAL	2.65 mm	7.5 mm		NOT SPECIFIED	NOT SPECIFIED	11 mm	CMOS			.65 mm	R-PDSO-G32		Not Qualified
MPC8548ECVJAVGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
LH7A404N0W000	NXP Semiconductors		INDUSTRIAL								1.8,3.3		DIE OR CHIP		85 Cel	-40 Cel											Other uPs/uCs/Peripheral ICs				Not Qualified
MPC8548ECVJAQHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548CVJAQGA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MPC8548EVTAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8360EVVAGFG	NXP Semiconductors
MPC8271CZQMIB	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM									Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935369482023	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			2.06 mm	CMOS	1.8 V		.5 mm	R-PBGA-B12
935289366118	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL PALLADIUM GOLD					30	260							1		e4
LPC55S28JBD64	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
MC13224VR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	99	LGA	SQUARE	UNSPECIFIED	YES	3.6 V		GRID ARRAY		2 V	105 Cel	-40 Cel		BOTTOM	1.2 mm	9.5 mm		40	260	9.5 mm	CMOS	2.7 V			S-XBGA-N99	3
MC68302RC25	NXP Semiconductors		COMMERCIAL		132			PLASTIC/EPOXY	NO		5		PGA132,15X15		70 Cel	0 Cel									CMOS	5 V	Other uPs/uCs/Peripheral ICs				Not Qualified
MPC8548ECVJAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935361281557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404N0E000B1A	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
CLRD701/HAB	NXP Semiconductors
MF1PH4200DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED							CMOS				R-XXMA-N
MPC8548CVTATGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm		NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548CVJAVHA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MC9328MXLVM15R2	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	70 Cel	0 Cel		BOTTOM	1.6 mm	14 mm		40	260	14 mm	CMOS	1.8 V		.8 mm	S-PBGA-B256	3
MF3MODH4101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
935289364118	NXP Semiconductors	MICROPROCESSOR CIRCUIT															Nickel/Palladium/Gold (Ni/Pd/Au)													1		e4
IW416UK/A1CZ	NXP Semiconductors	SoC																					260							1
MPC8548ECVTAUHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.