NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MF3ICD2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
935361269557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MF3MODH4101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MPC8272CZQPIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM									Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935309323518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					30	250							3		e4
MPC8248ZQTIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935363515118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	90 Cel	-40 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS	1.8 V		.8 mm	S-PDSO-N8
SCIMX534AVV8C	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				40	260							3
MPC8247CZQTIEA	NXP Semiconductors	SoC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e0
MPC8248ZQPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MKW31Z256VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER		1.71 V	105 Cel	-40 Cel		QUAD							CMOS	3.3 V			S-XQCC-N48
MPC8272ZQMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8360EZUALDH	NXP Semiconductors
MF3DHA200DA4/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548ECPXAVGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8360EVVAGDE	NXP Semiconductors
935320812557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS			.8 mm	S-PBGA-B624
MC9328MXLDVP15	NXP Semiconductors	SoC		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.7 V	70 Cel	-30 Cel		BOTTOM	1.6 mm	13 mm				13 mm	CMOS	1.8 V		.8 mm	S-PBGA-B225
LH7A400N0F076	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM									Other Microprocessor ICs	1 mm	S-PBGA-B256		Not Qualified
MPC8360EZUADFH	NXP Semiconductors
MPC8548EVJAVJB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAQHB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MC68302EH25CR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		5.5 V				4.5 V	70 Cel	0 Cel	TIN	UNSPECIFIED				40	260		CMOS	5 V				3		e3
MPC8548PXATGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e0
MPC8548ECVJAVHA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MF1PH4101DUF/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER							CMOS				X-XUUC-N
EM773FHN33,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel		QUAD	1 mm	7 mm				7 mm	CMOS	3.3 V		.65 mm	S-PQCC-N33
MC68302CRC16	NXP Semiconductors		INDUSTRIAL		132			PLASTIC/EPOXY	NO		5		PGA132,15X15		85 Cel	-40 Cel									CMOS	5 V	Other uPs/uCs/Peripheral ICs				Not Qualified
MF1P4101DUF/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER							CMOS				X-XUUC-N
MF1P2101DUF/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER							CMOS				X-XUUC-N
MPC860SRZP50	NXP Semiconductors
935368097118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS	1.8 V		.8 mm	S-PDSO-N8
MF1P4101DA6/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS				R-XXMA-N
MPC8548CVJAUJD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-PBGA-B783	3	Not Qualified
MF3ICDH4101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MM912KS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel	Tin (Sn)	QUAD	1.6 mm	14 mm		40	260	14 mm	CMOS	3.3 V		.5 mm	S-PQFP-G100	3		e3
MF3D8201DUD/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF3MOD8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS				X-PXMA-N
MPC8271ZQPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MF1PH4131DUF/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER							CMOS				X-XUUC-N
MF3DHA200DA6/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548EVTAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548ECVJAVHB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935357607557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MPC8548EVTAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548ECPXAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935314739557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS			.8 mm	S-PBGA-B624
MPC8248CZQTIEA	NXP Semiconductors	SoC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.