NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
P60D080PX30	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			IT ALSO OPERATES WITH 3V AND 5V SUPPLY				CMOS		1.8 V			X-XUUC-N
P5SC072EV0/TXXX	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER					PLASTIC/EPOXY			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel												Other Microprocessor ICs				Not Qualified
T1014NXN7MNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
S32G254ASBK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
TDA8002U/3/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V		UNCASED CHIP		3 V	85 Cel	-25 Cel		UPPER							CMOS		5 V			X-XUUC-N		Not Qualified
T1014NSNC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
T1024NSEC4MQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
P5CD016HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD		5 mm	ALSO OPERATES AT 3V, 5V SUPPLY			5 mm	CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
NT2H0301F0DTL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.08,20		70 Cel	-25 Cel		DUAL	.8 mm	2 mm				3 mm	CMOS			Serial IO/Communication Controllers	.5 mm	R-PDSO-N8		Not Qualified
T1014NSNC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780
P5CD128X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1.98 V		MICROELECTRONIC ASSEMBLY		1.62 V	85 Cel	-25 Cel		DUAL							CMOS		1.8 V			R-XDMA-X
PNX1311EH/G	NXP Semiconductors
P5CC040XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED							CMOS		1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified
S32G233ASAK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL
P5CD051XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel	PALLADIUM	UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY				CMOS		1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified	e4
TDA8007BHL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	6 V	3/5	FLATPACK	QFP48,.35SQ,20	2.7 V	85 Cel	-25 Cel	MATTE TIN	QUAD							CMOS	300 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQFP-G48		Not Qualified	e3
P5CD020A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X		Not Qualified
PM912JS812AMAF	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			125 Cel	-40 Cel		QUAD	1.6 mm	14 mm				14 mm	CMOS				.5 mm	S-PQFP-G100
SDIO101IHE	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	60	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel		BOTTOM	.6 mm	5 mm				5 mm	CMOS		1.8 V		.5 mm	S-PBCC-B60		Not Qualified
P5CC080HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD							CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
S32G274AAAK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
S32G254ASAK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL
UDA1325H/N108	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		FLATPACK		3 V	70 Cel	0 Cel		QUAD			ALSO REQUIRES 5V SUPPLY				CMOS		3.3 V			R-PQFP-G64		Not Qualified
T1024NSN7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
NT2L1211G0DUDV	NXP Semiconductors
S32G274AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																			40	260								3
TDA8002CT/B/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm				17.9 mm	CMOS		3.3 V		1.27 mm	R-PDSO-G28		Not Qualified	e4
P60C144PHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		1.8/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD							CMOS			Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
MF0ICU1001W/U7D,00	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER										DIE OR CHIP		70 Cel	-25 Cel												Other Microprocessor ICs				Not Qualified
P5CN080HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD							CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
NHS3100/A1X	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				NOT SPECIFIED	NOT SPECIFIED
S32G274ASAK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL
PCA9504A	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel		DUAL	1.2 mm	6.1 mm		NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3.3 V		.5 mm	R-PDSO-G56		Not Qualified
S32G234MSAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
SL2MOS5401EV	NXP Semiconductors	MICROPROCESSOR CIRCUIT						PLASTIC/EPOXY				MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)															Other Microprocessor ICs				Not Qualified
P5CD040A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X		Not Qualified
NHS3152	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel	-40 Cel		QUAD	1 mm	4 mm				4 mm	CMOS		3.3 V		.5 mm	S-PQCC-N24
ISP1132DL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, SHRINK PITCH		4 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2.8 mm	7.5 mm				18.425 mm	CMOS		5 V		.635 mm	R-PDSO-G56		Not Qualified	e4
MF3DH2300DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	XMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		UNSPECIFIED							CMOS					R-PXMA-N8
MF3D8200DA4/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935317691557	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MPC8548ECVJAQGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3D2300DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	4	DMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		DUAL							CMOS					R-PDMA-N4
935361156557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
IW416HN/A1IK	NXP Semiconductors	SoC																					260								3
MPC8548ECVJAQJA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAUGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC68153P	NXP Semiconductors		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		5	IN-LINE	DIP40,.6		70 Cel	0 Cel		DUAL							MOS	385 mA	5 V	Other uPs/uCs/Peripheral ICs	2.54 mm	R-XDIP-T40		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.