NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MF4SAM3X84/9BA6AU

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8548EVJAUHB

NXP Semiconductors

SoC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MPC8360EZUAGFH

NXP Semiconductors

MC9328MXLCVM15R2

NXP Semiconductors

SoC

BALL

256

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA256,16X16,32

1.7 V

85 Cel

-40 Cel

BOTTOM

1.6 mm

14 mm

40

260

14 mm

CMOS

1.8 V

.8 mm

S-PBGA-B256

3

MF3DH8300DA8/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

8

XMA

RECTANGULAR

PLASTIC/EPOXY

NO

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

UNSPECIFIED

CMOS

R-PXMA-N8

MF3DH9200DU75/02

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MPC8548PXAQGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e0

MC9328MXLDVP20R2

NXP Semiconductors

SoC

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

1.7 V

70 Cel

-30 Cel

BOTTOM

1.6 mm

13 mm

13 mm

CMOS

1.8 V

.8 mm

S-PBGA-B225

MPC8360EZUAJDC

NXP Semiconductors

MC68QH302PV25

NXP Semiconductors

MPC8548ECVJAUJC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3DH8201DUD/01

NXP Semiconductors

MICROPROCESSOR CIRCUIT

LH79520-N0Q-000

NXP Semiconductors

COMMERCIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

70 Cel

0 Cel

QUAD

Other Microprocessor ICs

.4 mm

S-PQFP-G176

Not Qualified

LPC55S69JBD100

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

LH7A404N0E000B2

NXP Semiconductors

COMMERCIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

70 Cel

0 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

MPC8360EVVALDH

NXP Semiconductors

MPC8548EVJAVGB

NXP Semiconductors

SoC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3DA200DA4/02

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935357614557

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

21 mm

CMOS

.8 mm

S-PBGA-B624

MF1P4101DUD/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

MPC8360EZUADDG

NXP Semiconductors

MC68302EH25C

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

5.5 V

4.5 V

70 Cel

0 Cel

TIN

UNSPECIFIED

40

260

CMOS

5 V

3

e3

LH7A404N0F000B1A

NXP Semiconductors

INDUSTRIAL

BALL

324

FBGA

SQUARE

CERAMIC

YES

1.8,3.3

GRID ARRAY, FINE PITCH

BGA324,20X20,32

85 Cel

-40 Cel

BOTTOM

Other uPs/uCs/Peripheral ICs

.8 mm

S-XBGA-B324

Not Qualified

MPC8360EVVALDE

NXP Semiconductors

MPC8548EVTATHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3DHA200DU75/02

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MF1PH2131DUF/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

MPC8548EPXAUHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MPC8548ECPXAUHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF3MODH8101DA8/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

PLASTIC/EPOXY

YES

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

CMOS

X-PXMA-N

935313293557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL GOLD

40

260

3

e4

935372576118

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

OTHER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1.98 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,32

1.62 V

85 Cel

-25 Cel

DUAL

1 mm

4 mm

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

4 mm

CMOS

1.8 V

.8 mm

S-PDSO-N8

MPC8548ECVJATJA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

935338909557

NXP Semiconductors

SYSTEM ON CHIP

TIN SILVER COPPER

30

250

3

e1

MPC8548VJATGA

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e2

MPC8360EVVAJFH

NXP Semiconductors

MPC8548ECVTATGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

935311754518

NXP Semiconductors

SYSTEM ON CHIP

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.275 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.6 mm

21 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

LPC55S28JEV98

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

MC68QH302PV20

NXP Semiconductors

MF1P2131DUF/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

MF1P4230DA8/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

85 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MPC8358EZUADDC

NXP Semiconductors

JN5178

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

125 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

3 V

.5 mm

S-PQCC-N40

MPC8548VTAUJD

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

40

260

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

3

e2

MPC8548ECVJAUHA

NXP Semiconductors

SoC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF1PH4230DA8/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

85 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

LH79525N0E100A0

NXP Semiconductors

INDUSTRIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

85 Cel

-40 Cel

QUAD

Other Microprocessor ICs

.4 mm

S-PQFP-G176

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.