NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MPC8548ECPXAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935307926012	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935361133557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935322964699	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8272CVRTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM										Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
LPC5528JEV98	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR
MF3DH4200DA6/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935313421557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					30	250								3		e4
MCZ33780EG	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	5,9/25	SMALL OUTLINE	SOP16,.4	4.75 V	85 Cel	-40 Cel	TIN	DUAL	2.65 mm	7.5 mm		40	260	10.3 mm	CMOS	23 mA	5 V	Parallel IO Port	1.27 mm	R-PDSO-G16	3	Not Qualified	e3
MPC8360EZUAJFE	NXP Semiconductors
MPC8247CVRMIB	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM										Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548EVTAQJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
LH7A404N0C000	NXP Semiconductors		INDUSTRIAL								1.8,3.3		DIE OR CHIP		85 Cel	-40 Cel												Other uPs/uCs/Peripheral ICs				Not Qualified
935314651528	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935386984472	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm		30	260	3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20	1		e4
MPC8360EZUADDE	NXP Semiconductors
MF1PH2131DA6/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
MPC8248ZQMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548ECVTATJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8247CZQMIBA	NXP Semiconductors	SoC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS		1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e0
MPC8548ECVTAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935311432557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS				.8 mm	S-PBGA-B624
935323702518	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					40	260								3		e4
MF1PH4101DA6/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
MPC8360EVVAGDH	NXP Semiconductors
MPC8360EZUAJDE	NXP Semiconductors
MPC8548ECVJAUGB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935361135557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8548EPXAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548VJAVHA	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
MF3DH2201DUD/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935314256518	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MF1P2200DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
MPC8548EVJAQGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC13226V	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	99	LGA	SQUARE	UNSPECIFIED	YES	3.6 V		GRID ARRAY		2 V	105 Cel	-40 Cel		BOTTOM	1.2 mm	9.5 mm		40	260	9.5 mm	CMOS		2.7 V			S-XBGA-N99	3
MPC8548ECVJATJB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3DH8200DA6/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548ECVJAVGB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
LH7A404N0E000B3	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM										Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
MPC8358EVVADDG	NXP Semiconductors
MPC8360EZUAGFE	NXP Semiconductors
MPC8548CVJAUJB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
MF3D4300DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	4	DMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		DUAL							CMOS					R-PDMA-N4
MF1P4131DUF/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						70 Cel	-25 Cel		UPPER							CMOS					X-XUUC-N
MF3D8300DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	XMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		UNSPECIFIED							CMOS					R-PXMA-N8
MF1P2230DA4/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
MPC8548ECVJATHA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
LH79525N0F100A0	NXP Semiconductors		INDUSTRIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	FLATPACK	QFP176,.87SQ,16		85 Cel	-40 Cel		QUAD										Other Microprocessor ICs	.4 mm	S-PQFP-G176		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.