NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MC92600JUB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY		1.65 V	70 Cel	0 Cel		BOTTOM	2.32 mm	23 mm	30	220	23 mm	CMOS	1.8 V		1.27 mm	S-PBGA-B217	3	Not Qualified
MF1P2230DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						85 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
MF3DH9200DU15/02	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935386987472	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	90 Cel	-25 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm	3 mm	30	260	3 mm	CMOS	1.8 V		.4 mm	S-PQCC-N20	1		e4
935361157557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MPC8358EZUAGDE	NXP Semiconductors
MF3ICDH8101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER						CMOS		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MPC8248CVRMIB	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8247ZQPIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM						CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8360EZUALDE	NXP Semiconductors
LH79520-N0M-000	NXP Semiconductors		COMMERCIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	FLATPACK	QFP176,.87SQ,16		70 Cel	0 Cel		QUAD								Other Microprocessor ICs	.4 mm	S-PQFP-G176		Not Qualified
MPC8548E	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM						CMOS	1.1 V			R-PBGA-B783
MPC8548ECPXATHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935316461557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
LH79525N0F100A1	NXP Semiconductors		INDUSTRIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	FLATPACK	QFP176,.87SQ,16		85 Cel	-40 Cel		QUAD								Other Microprocessor ICs	.4 mm	S-PQFP-G176		Not Qualified
KCIMX6D6AVT08ACR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935311087557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															TIN				40	260							3		e3
MPC8360EVVAJFE	NXP Semiconductors
MPC8548EVJAUHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MPC8548EVTAQHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
MC92600CJUB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY		1.65 V	70 Cel	-40 Cel		BOTTOM	2.32 mm	23 mm	30	220	23 mm	CMOS	1.8 V		1.27 mm	S-PBGA-B217	3	Not Qualified
MPC8548CVTAVHC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	NOT SPECIFIED	NOT SPECIFIED	29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783
935361154557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
MF3D4200DA6/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
LH7A400N0F000	NXP Semiconductors		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	1 mm	S-PBGA-B256		Not Qualified
MF4SAM3U15/9BA6AU	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8272VRMIB	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM						CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935361151557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
IW416HN/A1CMP	NXP Semiconductors	SoC																				260							3
MPC8271VRTIE	NXP Semiconductors		COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40		70 Cel	0 Cel		BOTTOM						CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MF1P2131DA4/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED						CMOS				R-XXMA-N
MF3D4300DA8/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	XMA	RECTANGULAR	PLASTIC/EPOXY	NO			MICROELECTRONIC ASSEMBLY			85 Cel	-25 Cel		UNSPECIFIED						CMOS				R-PXMA-N8
935308967005	NXP Semiconductors	MICROPROCESSOR CIRCUIT																			30	260							1
JN5174	NXP Semiconductors	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel	-40 Cel		QUAD	1 mm	6 mm	NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS	3 V		.5 mm	S-PQCC-N40
MC68302EH20C	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		5.5 V				4.5 V	70 Cel	0 Cel	TIN	UNSPECIFIED			40	260		CMOS	5 V				3		e3
MPC8247CZQMIB	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548CVJAQGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2
MF3DH4301DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UNSPECIFIED						CMOS				X-XUUC-N
MC68302PV16V	NXP Semiconductors		COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		3.3	FLATPACK	QFP144,.87SQ,20		70 Cel	0 Cel		QUAD						CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G144		Not Qualified
MPC8271CZQPIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548VJATGD	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-PBGA-B783	3	Not Qualified
935361142557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404N0F000B2	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel		BOTTOM								Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935361155557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
EM773FHN33	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	33	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel		QUAD	1 mm	7 mm			7 mm	CMOS	3.3 V		.65 mm	S-PQCC-N33	3
MPC8271CVRPIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM								Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
935316342518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MPC8548VJAQGB	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm			29 mm	CMOS	1.1 V		1 mm	S-PBGA-B783			e2

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.