NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
935319435518	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MC9328MXLCVM15	NXP Semiconductors	SoC		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel	-40 Cel		BOTTOM	1.6 mm	14 mm		40	260	14 mm	CMOS		1.8 V		.8 mm	S-PBGA-B256	3
MF3DH2201DUF/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935357616557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				21 mm	CMOS				.8 mm	S-PBGA-B624
JN5169-001-M00-2Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					240								3
MPC8548VJAQGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783			e2
MPC8360EZUADFG	NXP Semiconductors
935318528557	NXP Semiconductors	MICROPROCESSOR CIRCUIT															NICKEL GOLD					40	260								3		e4
935310883557	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MM912F634DV2APR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	18 V		FLATPACK, LOW PROFILE, FINE PITCH		5.5 V	105 Cel	-40 Cel	TIN	QUAD	1.6 mm	7 mm		40	260	7 mm	CMOS		7 V		.5 mm	S-PQFP-G48	3		e3
MF1PH2131DA4/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
935310883578	NXP Semiconductors	MICROPROCESSOR CIRCUIT
MPC8548EVJAUHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MC68302CFC16	NXP Semiconductors		INDUSTRIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES		5	FLATPACK	SPQFP132,1.1SQ		85 Cel	-40 Cel		QUAD							CMOS		5 V	Other uPs/uCs/Peripheral ICs	.635 mm	S-PQFP-G132		Not Qualified
LH79520N0M000B1	NXP Semiconductors		COMMERCIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES		1.8,3.3	FLATPACK	QFP176,.87SQ,16		70 Cel	0 Cel		QUAD										Other uPs/uCs/Peripheral ICs	.4 mm	S-PQFP-G176		Not Qualified
MPC8247CVRTIE	NXP Semiconductors			BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.5,3.3	GRID ARRAY	BGA516,26X26,40					BOTTOM										Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516		Not Qualified
MPC8548EPXAVJC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF1PH4131DA6/02	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO						70 Cel	-25 Cel		UNSPECIFIED							CMOS					R-XXMA-N
I.MX31	NXP Semiconductors
MF1P2201DUD/00	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			UNSPECIFIED	UNSPECIFIED	YES						85 Cel	-25 Cel		UPPER							CMOS					X-XUUC-N
MF3D4201DUD/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT
935300281551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel		QUAD	.5 mm	5 mm				5 mm	CMOS		1.8 V		.5 mm	S-PQCC-N60
MPC8548ECVTAVGC	NXP Semiconductors	SoC		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm				29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8360EVVAJFG	NXP Semiconductors
LS1043ASE7KQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621
LS1084ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043ASN8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		.9 V		.8 mm	S-PBGA-B780
NT3H2211W0FUG	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL				UNSPECIFIED	UNSPECIFIED		3.6 V				1.67 V	105 Cel	-40 Cel									CMOS		1.8 V
MCIMX353DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm			1.8 V		.8 mm	S-PBGA-B400	3		e1
NT3H1101W0FUG	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	3.6 V		UNCASED CHIP		1.7 V	95 Cel	-40 Cel		UPPER							CMOS		1.8 V			X-XUUC-N
LS1043ASE7PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621
SE050B2HQ1/Z01SF	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel		QUAD	.33 mm	3 mm				3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20
MCIMX31DVKN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS			Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
MIMX8MN6DVTJZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel		BOTTOM	1.25 mm	14 mm				14 mm	CMOS		1 V		.5 mm	S-PBGA-B486
LS1088AXE7PQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780
MCIMX6U1AVM08ABR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	21 mm		40	260	21 mm	CMOS			Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified	e1
MIMX8MN6DVTJZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel		BOTTOM	1.25 mm	14 mm				14 mm	CMOS		1 V		.5 mm	S-PBGA-B486
LS1043ASN7MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621
LS1043ASN7QQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621
MIMX8MN5CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER					40	260								3		e2
LS1043AXE8QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		.9 V		.8 mm	S-PBGA-B780
MFRC52301HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD				30	260			10 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified	e4
LS1043ASE8PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		.9 V		.8 mm	S-PBGA-B780
LS1043AXN7QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621
MCIMX6DP4AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3
LS1048AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043AXE8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS		.9 V		.8 mm	S-PBGA-B780
LS1048AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.