NXP Semiconductors Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MPC8360EZUALFE

NXP Semiconductors

LPC55S66JEV98

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

935308503534

NXP Semiconductors

MICROPROCESSOR CIRCUIT

MF1PLUS8021DA4/03

NXP Semiconductors

MC68QH302PV16

NXP Semiconductors

MPC8548VJATGB

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e2

935307009115

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL PALLADIUM GOLD SILVER

30

260

1

e4

MF1P2131DUD/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

MPC8358EZUAGDC

NXP Semiconductors

LPC5526JBD100

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

MPC8247VRTIE

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MPC8548EVJAVHD

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

40

260

29 mm

CMOS

1.1 V

Microprocessors

1 mm

S-PBGA-B783

3

Not Qualified

LH79520N0M000B1,55

NXP Semiconductors

COMMERCIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

70 Cel

0 Cel

QUAD

Other uPs/uCs/Peripheral ICs

.4 mm

S-PQFP-G176

Not Qualified

MF1P4101DA4/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

70 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MF3MOD2101DA4/05

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

PLASTIC/EPOXY

YES

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

CMOS

X-PXMA-N

MM912JS812AMAFR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

3

e3

MPC8548VJAUJA

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e2

MPC8360EZUADDC

NXP Semiconductors

MPC8548EPXATGC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MF1PH2101DA6/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

70 Cel

-25 Cel

UNSPECIFIED

CMOS

R-XXMA-N

MPC8548EVJATHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

935323702557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL GOLD

40

260

3

e4

MKW01Z128CHNR

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NICKEL GOLD

40

260

3

e4

MKW21Z256VHT4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER

1.71 V

105 Cel

-40 Cel

NICKEL GOLD

QUAD

40

260

CMOS

3.3 V

S-XQCC-N48

3

e4

MC68302EH20CR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

5.5 V

4.5 V

70 Cel

0 Cel

UNSPECIFIED

40

260

CMOS

5 V

SCIMX536AVV8C

NXP Semiconductors

MICROPROCESSOR CIRCUIT

40

260

3

MM912IP812AMAF

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

100

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.7 V

125 Cel

-40 Cel

Matte Tin (Sn)

QUAD

1.6 mm

14 mm

40

260

14 mm

CMOS

.5 mm

S-PQFP-G100

3

e3

935341041538

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

935296208125

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

VQCCN

SQUARE

PLASTIC/EPOXY

YES

3.7 V

CHIP CARRIER, VERY THIN PROFILE

1.5 V

85 Cel

-40 Cel

QUAD

.5 mm

1.6 mm

1.6 mm

CMOS

.5 mm

S-PQCC-N8

MF3D2300DA8/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

8

XMA

RECTANGULAR

PLASTIC/EPOXY

NO

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

UNSPECIFIED

CMOS

R-PXMA-N8

MPC8360EVVALFE

NXP Semiconductors

MF1PH2101DUF/02

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

70 Cel

-25 Cel

UPPER

CMOS

X-XUUC-N

MPC8272CVRMIB

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

LPC5526JEV98

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

MPC8360EVVAGFH

NXP Semiconductors

MPC8271CVRMIB

NXP Semiconductors

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

BOTTOM

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

935314905557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

935316554528

NXP Semiconductors

MICROPROCESSOR CIRCUIT

TIN

40

260

3

e3

MPC8548ECVJATHB

NXP Semiconductors

SoC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

ALSO AVAILABLE IN BGA WITH STAMPED LID

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

MC68302CFC20

NXP Semiconductors

INDUSTRIAL

GULL WING

132

BQFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

SPQFP132,1.1SQ

85 Cel

-40 Cel

QUAD

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.635 mm

S-PQFP-G132

Not Qualified

935361134557

NXP Semiconductors

SYSTEM ON CHIP

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.055 V

GRID ARRAY, FINE PITCH

BGA780,28X28,32

.995 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

23 mm

30

250

23 mm

CMOS

1.025 V

.8 mm

S-PBGA-B780

3

e1

MC68302FC16

NXP Semiconductors

COMMERCIAL

GULL WING

132

BQFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

SPQFP132,1.1SQ

70 Cel

0 Cel

QUAD

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.635 mm

S-PQFP-G132

Not Qualified

MPC8360EZUAGFC

NXP Semiconductors

MF3DH4300DA4/00

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

4

DMA

RECTANGULAR

PLASTIC/EPOXY

NO

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

DUAL

CMOS

R-PDMA-N4

MPC8548CPXAUJC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

e0

935361139557

NXP Semiconductors

SYSTEM ON CHIP

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.055 V

GRID ARRAY, FINE PITCH

BGA780,28X28,32

.995 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.61 mm

23 mm

30

250

23 mm

CMOS

1.025 V

.8 mm

S-PBGA-B780

3

e1

MPC8548ECVTAQHC

NXP Semiconductors

SoC

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY

BGA783,28X28,40

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

29 mm

29 mm

CMOS

1.1 V

1 mm

S-PBGA-B783

935311097528

NXP Semiconductors

MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.