Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
22 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
48 Macrocells; Shared Input/Clock |
50 MHz |
24.13 mm |
48 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
33.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
48 Macrocells; Shared Input/Clock |
e0 |
28.6 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
220 °C (428 °F) |
24.2316 mm |
52 |
|||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
e0 |
220 °C (428 °F) |
24.2316 mm |
No |
52 |
|||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
No |
5.25 V |
128 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
66.7 MHz |
220 °C (428 °F) |
27.94 mm |
No |
52 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic |
90 ns |
Yes |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J68 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
220 °C (428 °F) |
No |
52 |
|||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
111.1 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
50 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
4.953 mm |
27.94 mm |
No |
48 Macrocells; 4 External Clocks; Shared Input/Clock |
22.2 MHz |
27.94 mm |
48 |
||||||||||||||||||||
Altera |
Mask PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
4.572 mm |
24.2316 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
33.3 MHz |
220 °C (428 °F) |
24.2316 mm |
52 |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Ceramic |
34 ns |
Yes |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-J68 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
90 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
5 |
Chip Carrier |
Macrocell |
4.5 V |
85 °C (185 °F) |
15 Dedicated Inputs, 45 I/O |
15 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
No |
62.5 MHz |
45 |
||||||||||||||||||||||||||
Altera |
Mask PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
4.572 mm |
24.2316 mm |
No |
48 Macrocells; 4 External Clocks; Shared Input/Clock |
40 MHz |
24.2316 mm |
48 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
24.13 mm |
No |
52 |
|||||||||||
Altera |
OT PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
45 ns |
No |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
1 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
24.2316 mm |
No |
48 Macrocells |
e0 |
18.5 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
45 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
40 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
83.3 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
QCCJ |
Square |
Ceramic |
90 ns |
Yes |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
1.27 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-XQCC-J68 |
No |
e0 |
220 °C (428 °F) |
No |
||||||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 48 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
151.5 MHz |
220 °C (428 °F) |
24.23 mm |
No |
48 |
|||||||||||
Altera |
UV PLD |
Military |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
50 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
e0 |
22.2 MHz |
220 °C (428 °F) |
24.13 mm |
No |
48 |
|||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
e0 |
220 °C (428 °F) |
24.2316 mm |
No |
52 |
|||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
24.13 mm |
No |
52 |
|||||||||||
|
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e1 |
184.1 MHz |
5 mm |
Yes |
52 |
|||||||||||||
|
Altera |
Flash PLD |
Industrial |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
52 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e1 |
118.3 MHz |
5 mm |
Yes |
52 |
|||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
40 MHz |
24.23 mm |
48 |
||||||||||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
90 ns |
No |
48 |
CMOS |
38535Q/M;38534H;883B |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
Altera |
OT PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
128 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
33.3 MHz |
220 °C (428 °F) |
24.23 mm |
No |
52 |
|||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
No |
128 |
CMOS |
38535Q/M;38534H;883B |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
4.96 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
27.94 mm |
No |
52 |
||||||||||||
Altera |
Flash PLD |
Industrial |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
52 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
118.3 MHz |
5 mm |
Yes |
52 |
||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P68 |
4.96 mm |
27.94 mm |
No |
128 Macrocells; 8 Labs |
62.5 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.25 V |
128 |
CMOS |
5 |
5 V |
Grid Array, Window |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
220 °C (428 °F) |
27.94 mm |
No |
52 |
||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
e0 |
40 MHz |
220 °C (428 °F) |
No |
48 |
||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
128 Macrocells; 8 Labs |
62.5 MHz |
24.23 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier, Window |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 1 External Clock |
66.7 MHz |
24.13 mm |
52 |
||||||||||||||||||||
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
7.9 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
184.1 MHz |
5 mm |
Yes |
52 |
||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
28 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
e0 |
40 MHz |
220 °C (428 °F) |
24.13 mm |
No |
48 |
|||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
80 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
24.2316 mm |
No |
48 Macrocells |
e0 |
18.5 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.5 V |
48 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
48 Macrocells; Shared Input/Clock |
e0 |
50 MHz |
220 °C (428 °F) |
24.2316 mm |
No |
48 |
|||||||||||
Altera |
UV PLD |
Commercial |
J Bend |
68 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC68,1.0SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQCC-J68 |
5.08 mm |
24.13 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
83.3 MHz |
220 °C (428 °F) |
24.13 mm |
No |
52 |
|||||||||||
Altera |
Flash PLD |
Other |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
192 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
85 °C (185 °F) |
52 I/O |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
118.3 MHz |
5 mm |
Yes |
52 |
||||||||||||||
Altera |
UV PLD |
Commercial |
Pin/Peg |
68 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
28 ns |
No |
5.25 V |
48 |
CMOS |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
2.54 mm |
70 °C (158 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P68 |
1 |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
e0 |
40 MHz |
220 °C (428 °F) |
No |
48 |
|||||||||||||
Altera |
UV PLD |
Military |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
33 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P68 |
3.81 mm |
27.94 mm |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
66.7 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 52 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.2316 mm |
No |
125 MHz |
24.2316 mm |
52 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.