UV PLD Programmable Logic Devices (PLD) 725

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
AT22V10-15DM	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
AT22V10-15DM/883	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz		10		32 mm		10
EPM5032DC-15	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz		16	220 °C (428 °F)			16
EPM5032DC-20	Altera	UV PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM5032JC-20	Altera	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.25 V		CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	320	1.27 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	11.43 mm		16
EPM5032JM-25	Altera	UV PLD	Military	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes			CMOS		24	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		320	1.27 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J28		4.57 mm	11.43 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		16	220 °C (428 °F)	11.43 mm		16
ATV750-25DM/883	Atmel	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	10	CMOS	MIL-STD-883 Class B			5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; Variable Product Terms	e0	45 MHz	30 s		240 °C (464 °F)	32 mm	No	10
EP1210DC	Altera	UV PLD	Commercial	Through-Hole	40	WDIP	Rectangular	Ceramic, Glass-Sealed	90 ns	No	5.25 V		CMOS		36	PAL-TYPE	5			In-Line, Window	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	236	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T40		5.715 mm	15.24 mm	No	28 Macrocells	e0	17.5 MHz		24	220 °C (428 °F)	52.07 mm		24
EP22V10EDC-10	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	95.2 MHz		10	220 °C (428 °F)	32 mm		10
5962-8872404LA	Defense Logistics Agency	UV PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		CMOS	MIL-STD-883			5			In-Line				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	31.2 MHz				32 mm		10
5962-9061102XA	Defense Logistics Agency	UV PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed		No			CMOS				5			In-Line				Macrocell				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				Yes		e0
CY7C342B-30RI	Cypress Semiconductor	UV PLD	Industrial	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	60 ns	No	5.5 V	128	CMOS				5		5 V	Grid Array, Window	PGA68,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				27.9527 mm	No	52
CY7C343-35HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	35 ns	Yes	5.5 V	64	CMOS				5		5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	22.2 MHz				16.51 mm	No	28
CY7C344-25WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 16 I/O	7	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		16		37.0205 mm		16
EP900JC	Altera	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Glass-Sealed	60 ns	Yes	5.25 V		CMOS		36	PAL-TYPE	5		5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-GQCC-J44		4.57 mm	16.51 mm	No	24 Macrocells	e0	20 MHz		24	220 °C (428 °F)	16.51 mm		24
5962-8867805RA	Defense Logistics Agency	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5			In-Line, Window				Combinatorial	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0					24.13 mm		6
5962-9154505MYX	Microchip Technology	UV PLD	Military	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	20 ns	Yes	5.5 V		CMOS	MIL-STD-883			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	13 Dedicated Inputs, 24 I/O	13	-55 °C (-67 °F)		Quad	S-CQCC-J44		4.57 mm	16.5862 mm	No			40 MHz				16.5862 mm		24
CY7C330-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	23	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	256	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 12 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Synchronous State Machine; 12 I/O Macrocells; 3 External Clocks; Shared Input/Clock	e0	40 MHz		12		37.0205 mm		12
CY7C342-30HI	Cypress Semiconductor	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	60 ns	Yes	5.5 V	128	CMOS				5		5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J68		5.08 mm	24.13 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	27.7 MHz				24.13 mm	No	52
CY7C344-20WC	Cypress Semiconductor	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	41.6 MHz		16		37.0205 mm		16
EP900DI	Altera	UV PLD	Industrial	Through-Hole	40	WDIP	Rectangular	Ceramic, Glass-Sealed	60 ns	No	5.5 V		CMOS		36	PAL-TYPE	5		5 V	In-Line, Window	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	240	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T40		5.715 mm	15.24 mm	No	24 Macrocells	e0	20 MHz		24	220 °C (428 °F)	52.07 mm		24
EPM5016DC-20	Altera	UV PLD	Commercial	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		CMOS		16	PAL-TYPE	5		5 V	In-Line, Window	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 8 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T20		5.334 mm	7.62 mm	No	Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		8	220 °C (428 °F)	24.13 mm		8
EPM5032DC-25	Altera	UV PLD	Commercial	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		24	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.75 V	320	2.54 mm	70 °C (158 °F)	7 Dedicated Inputs, 16 I/O	7	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)	36.83 mm		16
EPM5064JI	Altera	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	55 ns	Yes	5.5 V	64	CMOS				5		5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 28 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz			220 °C (428 °F)	16.51 mm	No	28
PALC22V10-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	18.1 MHz		10		31.877 mm		10
XC7372-10WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	23 ns	Yes	5.5 V	72	CMOS				5		3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	71.4 MHz				24.13 mm	No	25
TICPAL22V10CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24(UNSPEC)	Programmable Logic Devices		Macrocell	4.75 V	132		75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24				No	Shared Input/Clock				10				10
EP910JI-45	Texas Instruments	UV PLD	Industrial	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	45 ns	Yes	5.5 V		CMOS		36	PAL-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.5 V	240	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J44				No			22.2 MHz		24				24
TICPAL22V10Z-25CJTL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		31.2 MHz		10		32.005 mm		10
EP1810JC-45	Texas Instruments	UV PLD	Commercial	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired	50 ns	Yes	5.25 V	48	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 48 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J68				No	48 Macrocell; Configurable I/O		33.3 MHz					No	48
M38510/50704BKX	Texas Instruments	UV PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS				5			Flatpack				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-CDFP-F24				No									10
EP610DI-40	Texas Instruments	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	40 ns	No	5.5 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-CDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O				16				16
EP610JC-30	Texas Instruments	UV PLD	Commercial	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Quad	S-CQCC-J28				No	Zero Standby Function; 16 Macrocells With Configurable I/O		33.3 MHz		16				16
EP610DC-35	Texas Instruments	UV PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	37 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-CDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		28.6 MHz		16				16
M38510/50704BLX	Texas Instruments	UV PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS				5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-CDIP-T24				No									10
EP610DC-30	Texas Instruments	UV PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	32 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-CDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		33.3 MHz		16				16
PAL22V10Z-25CJTL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock	e0	31.2 MHz		10		32.005 mm	No	10
EP610JC-35	Texas Instruments	UV PLD	Commercial	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	37 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Quad	S-CQCC-J28				No	Zero Standby Function; 16 Macrocells With Configurable I/O		28.6 MHz		16				16
TICPAL16R6-55CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V		CMOS		16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20				No	Register Preload		16 MHz		6				2
EP1810JI-45	Texas Instruments	UV PLD	Industrial	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired	50 ns	Yes	5.5 V	48	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 48 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J68				No	48 Macrocell; Configurable I/O		33.3 MHz					No	48
EP1810JC-35	Texas Instruments	UV PLD	Commercial	J Bend	68	QCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.25 V	48	CMOS				5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 48 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J68				No	48 Macrocell; Configurable I/O		40 MHz					No	48
TICPAL22V10Z-25CJT	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.25 V		CMOS				5			In-Line				Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24				No	Shared Input/Clock		28.5 MHz						10
TICPAL16R4-55CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V		CMOS		16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20				No	Register Preload		16 MHz		4				4
EP910JC-35	Texas Instruments	UV PLD	Commercial	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	38 ns	Yes	5.25 V		CMOS		36	PAL-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J44				No	24 Macrocell; Configurable I/O		31.3 MHz		24				24
EP910JC-30	Texas Instruments	UV PLD	Commercial	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.25 V		CMOS		36	PAL-TYPE	5		5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J44				No			33.3 MHz		24				24
EP630-25IJT	Texas Instruments	UV PLD	Industrial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS		20	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			40 MHz		16		32.005 mm		16
EP630-25MJTB	Texas Instruments	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			40 MHz		16		32.005 mm		16
EP630-20CJT	Texas Instruments	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			50 MHz		16		32.005 mm		16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.