UV PLD Programmable Logic Devices (PLD) 725

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP610DC-25	Texas Instruments	UV PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	27 ns	No	5.25 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-CDIP-T24				No	Zero Standby Function; 16 Macrocells With Configurable I/O		40 MHz	16			16
EP610JC-25	Texas Instruments	UV PLD	Commercial	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	27 ns	Yes	5.25 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Quad	S-CQCC-J28				No	Zero Standby Function; 16 Macrocells With Configurable I/O		40 MHz	16			16
TICPAL16R8-55CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20				No	Register Preload		16 MHz	8			0
EP910DC-40	Texas Instruments	UV PLD	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	43 ns	No	5.25 V		CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	240	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Dual	R-CDIP-T40				No	24 Macrocell; Configurable I/O		29.4 MHz	24			24
EP910DC-30	Texas Instruments	UV PLD	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	33 ns	No	5.25 V		CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	240	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Dual	R-CDIP-T40				No	24 Macrocell; Configurable I/O		33.3 MHz	24			24
TICPAL22V10MJL	Texas Instruments	UV PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24(UNSPEC)	Programmable Logic Devices		Macrocell	4.5 V	132		125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24				No	Shared Input/Clock			10			10
TICPAL18V8-30MJL	Texas Instruments	UV PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	74	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)		Dual	R-GDIP-T20				No	PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock		35 MHz	8			8
EP910DI-45	Texas Instruments	UV PLD	Industrial	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V		CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	240	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Dual	R-CDIP-T40				No			22.2 MHz	24			24
TICPAL18V8-25CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)		Dual	R-GDIP-T20				No	PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock		35 MHz	8			8
TICPAL22V10Z-35CJT	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.25 V		CMOS				5		In-Line				Macrocell	4.75 V			75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24				No	Shared Input/Clock		20 MHz				10
EP910JC-40	Texas Instruments	UV PLD	Commercial	J Bend	44	QCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.25 V		CMOS		36	PAL-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.75 V	240	1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J44				No			25 MHz	24			24
EP610JI-40	Texas Instruments	UV PLD	Industrial	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V		CMOS		20	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	160	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Quad	S-CQCC-J28				No	Zero Standby Function; 16 Macrocells With Configurable I/O			16			16
TICPAL16L8-55CJL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V		CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 6 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T20				No				8			6
EP910DC-35	Texas Instruments	UV PLD	Commercial	Through-Hole	40	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	35 ns	No	5.25 V		CMOS		36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.75 V	240	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 24 I/O	12	0 °C (32 °F)		Dual	R-CDIP-T40				No			37 MHz	24			24
P3C18V8Z40FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	40 ns	No	3.6 V		CMOS				3.3		In-Line				Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-CDIP-T20		5.08 mm	7.62 mm	No	Programmable Output Polarity		22 MHz		24.305 mm		8
P3C18V8ZIAFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	3.6 V		CMOS				3.3		In-Line				Macrocell	3 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-CDIP-T20		5.08 mm	7.62 mm	No	Programmable Output Polarity		18 MHz		24.305 mm		8
PLC18V8Z25FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		CMOS				5		In-Line				Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz		24.305 mm		8
PLC18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		CMOS				5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		24.305 mm		8
P3C18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	3.6 V		CMOS				3.3		In-Line				Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		24.305 mm		8
PLC415-16FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.25 V		CMOS				5		In-Line				Registered	4.75 V			75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-GDIP-T28				No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		13.3 MHz				0
PLC18V8Z/BRA	NXP Semiconductors	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS				5		In-Line, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			25 MHz				8
PLC18V8ZIAFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS				5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz		24.305 mm		8
PLC42VA12IFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.5 V		CMOS				5		In-Line				Macrocell	4.5 V			85 °C (185 °F)	8 Dedicated Inputs, 12 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T24				No	Programmable Multi-Function Pld; Register Preload; Shared Input/Clock		14.9 MHz				12
PLC18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.25 V		CMOS				5		In-Line				Macrocell	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz		24.305 mm		8
P3C18V8Z35FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	3.6 V		CMOS				3.3		In-Line				Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		24.305 mm		8
PLC42VA12FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	55 ns	No	5.25 V		CMOS		42	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	105	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 12 I/O	8	0 °C (32 °F)		Dual	R-GDIP-T24	1			No	Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload		14.9 MHz	12			12
59628753906LX	Infineon Technologies	UV PLD	Military	Through-Hole		WDIP		Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS				5		In-Line, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual			5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	83 MHz		32 mm		10
5962-8946804XA	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	42 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz		27.9527 mm		52
5962-8946803XA	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	51 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		27.9527 mm		52
5962-8946804XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	42 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz		27.9527 mm		52
5962-8946805XA	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)	Tin Lead	Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	50 MHz		27.9527 mm		52
5962-8946805XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V		CMOS				5		Grid Array, Window				Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		5.08 mm	27.9527 mm	No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock		50 MHz		27.9527 mm		52
5962-8946803XX	Infineon Technologies	UV PLD	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	51 ns	No	5.5 V		CMOS	MIL-STD-883			5		Grid Array				Macrocell	4.5 V			125 °C (257 °F)	7 Dedicated Inputs, 52 I/O	7	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No							52
XC7236A-16WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		60 MHz		16.51 mm	No	30
XC73108-10PG144C	Xilinx	UV PLD	Commercial	Pin/Peg	144	WPGA	Square	Ceramic, Metal-Sealed Cofired	25 ns	No	5.25 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	PGA144,15X15	Programmable Logic Devices	No	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 78 I/O	12	0 °C (32 °F)		Perpendicular	S-CPGA-P144	1	3.683 mm	39.624 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		62.5 MHz		39.624 mm	No	78
XC73108-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz			No	78
XC7272-30WC68C	Xilinx	UV PLD	Commercial	J Bend	68	QCCJ	Square	Ceramic	48 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-XQCC-J68				No						No
XC7336Q-12WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		80 MHz		16.51 mm	No	32
XC7336Q-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		100 MHz		16.51 mm	No	32
XC7354-10WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz		16.51 mm	No	25
XC7336-10WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.25 V	36	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 32 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		100 MHz		16.51 mm	No	32
XC73108-15WC84C	Xilinx	UV PLD	Commercial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.25 V	108	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	12 Dedicated Inputs, 37 I/O	12	0 °C (32 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz		29.21 mm	No	37
XC7372-10WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	23 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		71.4 MHz		29.21 mm	No	37
XC7372-12WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz		24.13 mm	No	25
XC7354-12WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	27 ns	Yes	5.25 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 25 I/O	8	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops		66.7 MHz		16.51 mm	No	25
XC7272-25WC68I	Xilinx	UV PLD	Industrial	J Bend	68	QCCJ	Square	Ceramic	40 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-XQCC-J68				No						No
XC7272A-25WC84M	Xilinx	UV PLD	Military	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 42 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		40 MHz		29.21 mm	No	42
XC7236A-20WC44C	Xilinx	UV PLD	Commercial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.25 V	36	CMOS				5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 30 I/O	2	0 °C (32 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		40 MHz		16.51 mm	No	30

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.