Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Total Dose (V) | Maximum Supply Voltage | No. of Functions | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
27 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
25.6 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3580 MHz |
|||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
21.25 dBm |
435 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
20.5 dB |
-20 Cel |
Gold (Au) |
LOW NOISE, HIGH RELIABILITY |
e4 |
40 MHz |
900 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
20.5 dBm |
10 |
COMPONENT |
50 ohm |
150 Cel |
27 dB |
Matte Tin (Sn) |
e3 |
865 MHz |
960 MHz |
|||||||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
19 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
900 MHz |
|||||||||||||||||
|
NXP Semiconductors |
WIDE BAND LOW POWER |
COMPONENT |
50 ohm |
85 Cel |
5.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
40 MHz |
4000 MHz |
||||||||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
26 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
23 dB |
-40 Cel |
TIN |
e3 |
3400 MHz |
3800 MHz |
||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
23 dBm |
3 |
COMPONENT |
50 ohm |
90 Cel |
22.6 dB |
-20 Cel |
80 MHz |
108 MHz |
|||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
||||||||||||||||||||||||||
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
COMPONENT |
50 ohm |
12 dB |
Tin/Lead (Sn/Pb) |
e0 |
800 MHz |
2170 MHz |
|||||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
GAAS |
1 |
12 dBm |
10 |
COMPONENT |
3.6 |
TSSOP16,.25 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
e0 |
880 MHz |
915 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
26 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
26.5 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3700 MHz |
|||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
70 Cel |
0 Cel |
LOW NOISE |
100 MHz |
||||||||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
24.8 dBm |
3 |
COMPONENT |
50 ohm |
90 Cel |
-20 Cel |
146 MHz |
174 MHz |
||||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
7 dBm |
2 |
COMPONENT |
50 ohm |
100 Cel |
38.5 dB |
-30 Cel |
400 MHz |
470 MHz |
|||||||||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
TIN |
e3 |
2400 MHz |
3100 MHz |
||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
7 dBm |
MODULE |
75 ohm |
85 Cel |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
5 MHz |
400 MHz |
||||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
80 Cel |
25 dB |
-10 Cel |
LOW NOISE |
860 MHz |
|||||||||||||||||||||
|
NXP Semiconductors |
WIDE BAND LOW POWER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
32 mA |
COMPONENT |
5 |
TSSOP6,.08 |
50 ohm |
RF/Microwave Amplifiers |
28 dB |
Tin (Sn) |
e3 |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
TIN |
e3 |
3200 MHz |
4000 MHz |
||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
19 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
600 MHz |
|||||||||||||||||
|
NXP Semiconductors |
WIDE BAND LOW POWER |
COMPONENT |
85 Cel |
5 dB |
-40 Cel |
TIN |
e3 |
40 MHz |
4000 MHz |
|||||||||||||||||
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
7 dBm |
3 |
COMPONENT |
50 ohm |
100 Cel |
27.8 dB |
-30 Cel |
898 MHz |
928 MHz |
|||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
1 |
28 |
FL16(UNSPEC) |
RF/Microwave Amplifiers |
|||||||||||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
TIN |
e3 |
|||||||||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
24.77 dBm |
2 |
MODULE |
50 ohm |
90 Cel |
68 MHz |
88 MHz |
|||||||||||||||||||
|
NXP Semiconductors |
WIDE BAND LOW POWER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
1 |
-10 dBm |
25 mA |
COMPONENT |
5 |
TSSOP6,.08 |
50 ohm |
RF/Microwave Amplifiers |
85 Cel |
25 dB |
-40 Cel |
Tin (Sn) |
LOW NOISE |
e3 |
100 MHz |
3000 MHz |
|||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
10 |
COMPONENT |
50 ohm |
31 dB |
Matte Tin (Sn) |
e3 |
869 MHz |
960 MHz |
|||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
16.25 dBm |
MODULE |
75 ohm |
100 Cel |
16.5 dB |
-20 Cel |
LOW NOISE |
40 MHz |
550 MHz |
|||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
19.5 dBm |
2 |
MODULE |
50 ohm |
90 Cel |
-30 Cel |
400 MHz |
440 MHz |
||||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
1.5 |
COMPONENT |
50 ohm |
70 Cel |
16 dB |
0 Cel |
0 MHz |
350 MHz |
||||||||||||||||||
|
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
MODULE |
75 ohm |
100 Cel |
21.5 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
750 MHz |
|||||||||||||||||
NXP Semiconductors |
WIDE BAND HIGH POWER |
3 dBm |
1.25 |
MODULE |
50 ohm |
100 Cel |
24 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
870 MHz |
||||||||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
PLASTIC/EPOXY |
HYBRID |
410 mA |
MODULE |
24 |
SOT-115J |
75 ohm |
RF/Microwave Amplifiers |
100 Cel |
18.5 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
860 MHz |
|||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
2 dBm |
50 ohm |
85 Cel |
35.5 dB |
-20 Cel |
LOW NOISE |
880 MHz |
915 MHz |
||||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
10 dBm |
COMPONENT |
75 ohm |
70 Cel |
10 dB |
-10 Cel |
TIN |
e3 |
40 MHz |
1000 MHz |
||||||||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
26.5 dB |
-20 Cel |
GOLD |
LOW NOISE |
e4 |
40 MHz |
1003 MHz |
||||||||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
PLASTIC/EPOXY |
MOS |
1 |
20 dBm |
3 |
COMPONENT |
26 |
FLNG,.8''H SPACE |
50 ohm |
RF/Microwave Amplifiers |
21.5 dB |
Matte Tin (Sn) |
e3 |
1930 MHz |
1990 MHz |
||||||||||
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
7 dBm |
3 |
COMPONENT |
50 ohm |
100 Cel |
27.8 dB |
-30 Cel |
824 MHz |
849 MHz |
|||||||||||||||||
NXP Semiconductors |
WIDE BAND HIGH POWER |
MODULE |
75 ohm |
100 Cel |
33.2 dB |
-20 Cel |
LOW NOISE |
40 MHz |
750 MHz |
||||||||||||||||||
|
NXP Semiconductors |
SURFACE MOUNT |
3 |
PLASTIC/EPOXY |
1 |
125 mA |
5 |
TO-243 |
RF/Microwave Amplifiers |
TIN |
e3 |
||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
16.25 dBm |
MODULE |
75 ohm |
100 Cel |
-20 Cel |
40 MHz |
450 MHz |
|||||||||||||||||||
NXP Semiconductors |
WIDE BAND MEDIUM POWER |
MODULE |
75 ohm |
100 Cel |
12.5 dB |
-20 Cel |
LOW NOISE |
40 MHz |
450 MHz |
||||||||||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
1.4 |
MODULE |
75 ohm |
40 MHz |
860 MHz |
|||||||||||||||||||||
NXP Semiconductors |
NARROW BAND MEDIUM POWER |
SURFACE MOUNT |
4 |
PLASTIC/EPOXY |
HYBRID |
7 dBm |
3 |
.1 mA |
MODULE |
3.6 |
SMSIP4 |
50 ohm |
RF/Microwave Amplifiers |
100 Cel |
-30 Cel |
872 MHz |
905 MHz |
||||||||||
NXP Semiconductors |
NARROW BAND HIGH POWER |
PLASTIC/EPOXY |
1 |
20 dBm |
2 |
320 mA |
COMPONENT |
26 |
FLNG,1.6"H.SPACE |
50 ohm |
RF/Microwave Amplifiers |
90 Cel |
28 dB |
-20 Cel |
869 MHz |
894 MHz |
|||||||||||
NXP Semiconductors |
WIDE BAND LOW POWER |
1.5 |
COMPONENT |
50 ohm |
70 Cel |
17 dB |
0 Cel |
550 MHz |
|||||||||||||||||||
|
NXP Semiconductors |
WIDE BAND LOW POWER |
SURFACE MOUNT |
3 |
PLASTIC/EPOXY |
1 |
15 dBm |
86 mA |
COMPONENT |
8 |
TO-243 |
50 ohm |
RF/Microwave Amplifiers |
15 dB |
Tin (Sn) |
e3 |
850 MHz |
2500 MHz |
|||||||||
NXP Semiconductors |
NARROW BAND LOW POWER |
MODULE |
75 ohm |
100 Cel |
19 dB |
-20 Cel |
LOW NOISE, HIGH RELIABILITY |
40 MHz |
750 MHz |
RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.
The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.
RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.