BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF51822-CEAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B62		.55 mm	3.5 mm				NOT SPECIFIED	NOT SPECIFIED	3.83 mm
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
NRF52840-CKAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	93	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA93,10X10,14		.35 mm	85 Cel		-40 Cel		BOTTOM	2 Mbps	R-PBGA-B93	1	.514 mm	3.544 mm						3.607 mm
NRF51822-CFAC-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		S-PBGA-B62		.55 mm	3.83 mm				NOT SPECIFIED	NOT SPECIFIED	3.83 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
NRF52840-QIAA	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B73	2	.85 mm	7 mm						7 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
SN65DSI84ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm				30	260	12 mm
SJA1105TELY	NXP Semiconductors	TELECOM CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel		-40 Cel		BOTTOM	100 Mbps	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
BQ51013BYFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm				30	260	12 mm
SN65DSI83ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm				30	260	10 mm
BLUENRG-134	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel		-40 Cel		BOTTOM		R-PBGA-B34		.5 mm	2.56 mm				NOT SPECIFIED	NOT SPECIFIED	2.66 mm
ADRV9009BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1		260	12 mm
ADRV9009BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			e1		260	12 mm
CC2640R2FYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm			e1	30	260	2.684 mm
BQ51013BYFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
BQ51003YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
SN65DSI83ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
NRF51822-CDAB-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B56	1	.55 mm	3.33 mm						3.5 mm
CC2640R2FYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm			e1	30	260	2.684 mm
NRF51822-CFAC-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		S-PBGA-B62		.55 mm	3.83 mm				NOT SPECIFIED	NOT SPECIFIED	3.83 mm
CC2564BYFVR-XI	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm			e1	30	260	3.26 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm				30	260	10 mm
PM-8916-0-176NSP-TR-02-1-01	Qualcomm	TELECOM CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		HVCMOS			3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		S-PBGA-B176	3	.86 mm	6.2 mm						6.2 mm
LMS7002M	Lime Microsystems	TELECOM CIRCUIT	INDUSTRIAL	BALL	261	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY				85 Cel		-40 Cel		BOTTOM		S-PBGA-B261			11.5 mm						11.5 mm
CC2564BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm			e1	30	260	3.26 mm
SN65DSI86ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	5400 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
ADRV9026BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4					1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm		ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
SJA1105EL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1	30	260	12 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4					1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm		ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
ADRV9008BBCZ-1	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm					260	12 mm
GS2972-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.7 mm	11 mm			e1		260	11 mm
LMX9838SBX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	70	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B70	4	2.1 mm	10 mm	Not Qualified			30	250	17 mm
BQ51013AYFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
ADRV9008BBCZ-1REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm					260	12 mm
SN65LVCP114ZJA	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	167	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4	8				2.5 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA167,14X14,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	14200 Mbps	S-PBGA-B167	3	1.35 mm	12 mm	Not Qualified		e1	30	260	12 mm
ADRV9008BBCZ-2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm					260	12 mm
SX8651ICSTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-PBGA-B12	1	.625 mm	1.5 mm			e4		260	2 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified		e1	30	260	5 mm
ADV7533BCBZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	UNSPECIFIED	YES	1		CMOS			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-10 Cel	TIN SILVER COPPER	BOTTOM		S-XBGA-B49	1	.66 mm	3.46 mm	Not Qualified		e1	30	260	3.46 mm
BQ51003YFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
LMX9830SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
SN65DSI85ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm			e1	30	260	5 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD6676BCBZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B80	1	.66 mm	5.04 mm			e1	30	260	4.29 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.