BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2564YFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
BQ51010YFFT	Texas Instruments	TELECOM CIRCUIT		BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		R-XBGA-B28		.625 mm	1.56 mm	Not Qualified					2.76 mm
BQ51021YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
CC2564YFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
LMX9830SM/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
BQ51011YFFR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
AFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
CC2564NYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY				85 Cel		-40 Cel		BOTTOM		R-PBGA-B54	1						30	260
LMX9830SM	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel		BOTTOM		R-PBGA-B60		1.3 mm	6 mm	Not Qualified					9 mm
TLK2711GQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified					5 mm
BQ51010YFFR	Texas Instruments	TELECOM CIRCUIT		BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		R-XBGA-B28		.625 mm	1.56 mm	Not Qualified					2.76 mm
SN65DSI85ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
CC2564NYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
BQ51013AYFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
BQ51020YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
BQ51011YFFT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
BQ51025YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
BQ51021YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
BQ51025YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
TSC2005IYZLR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	2.75 mm	Not Qualified		e1	30	260	3.25 mm
BQ51014YFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
LMX9820ASMX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B116		2 mm	9.95 mm						14 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm				TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000	e1		260	17 mm
AFE7901IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V		GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e0		220	17 mm
AFE7901IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V		GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e1		260	17 mm
ADP5589ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm	1.99 mm			e1	30	260	1.99 mm
AD6679BBPZ-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.49 mm	12 mm			e1	30	260	12 mm
ADSP-21MOD980-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY			1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified		e0			35 mm
FIDO5110CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel		-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9993BBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	12 mm						12 mm
ADP5589ACBZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm	1.99 mm			e1	30	260	1.99 mm
FIDO5100CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel		-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9993BBCPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	12 mm						12 mm
AD99988BBPZ-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	120 Cel		-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm						15 mm
ADP5586ACBZ-03-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm			e1			1.59 mm
ADP5585ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm			e1	30	260	1.59 mm
DS3131+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B272		2.34 mm	27 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	27 mm
AD6624ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196		1.5 mm	15 mm	Not Qualified		e0			15 mm
AD9082BBPZ-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
ADSP-21MOD980N-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.9 V	1.9,3.3	GRID ARRAY	BGA352,26X26,50	Modems	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified		e0			35 mm
AD6679BBPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.49 mm	12 mm				30	260	12 mm
AD6623ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified		e0		240	17 mm
AD9993BBCZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm	12 mm				30	260	12 mm
AD6426XB	Analog Devices		OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			2.4/3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel		-25 Cel	Tin/Lead (Sn/Pb)	BOTTOM		S-PBGA-B144				Not Qualified		e0
AD9082BBPZRL-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
AD6652XBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.5 V		GRID ARRAY			1 mm	70 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified		e0			17 mm
LTM9013IY-AA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B196		3.02 mm	15 mm		3.3v and 5v power supply also require to operate the device		NOT SPECIFIED	NOT SPECIFIED	15 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.