BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMV243BLX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	8	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B8		1.095 mm	1.514 mm						1.514 mm
TPS657202YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm			e1	30	260	2.086 mm
LMX5452SMX	Texas Instruments		INDUSTRIAL	BALL	60	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/3.3	GRID ARRAY, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B60	3			Not Qualified			20	235
GC4116-PB-ASY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B160			15 mm	Not Qualified					15 mm
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500	e1	30	260	17 mm
LM3291TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B12	1	.675 mm				e1	30	260
PAFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH			.8 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B400		2.65 mm	17 mm						17 mm
XWL1835MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TCA8418YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY				85 Cel		-40 Cel			BOTTOM		S-PBGA-B25				Not Qualified
LMV1099TLX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B25		.675 mm	2.644 mm	Not Qualified					2.771 mm
SN74AVC6T622ZXYR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			.015 mA	1.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	3.6 V	BOTTOM	50 Mbps	R-PBGA-B20	1	.61 mm	2.5 mm	Not Qualified		e1	30	260	3 mm
TCA5013ZAHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		S-PBGA-B48	3	1.2 mm	5 mm			e1	30	260	5 mm
WL1835MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TPS657051YZHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified		e1	30	260	2.3 mm
XWL1801MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TLK10081CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	10000 Mbps	S-PBGA-B144	4	3.25 mm	13.05 mm			e1	30	260	13.05 mm
TLK3138GDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2	CMOS	2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel		0 Cel	TIN LEAD		BOTTOM	3125 Mbps	S-PBGA-B484	4			Not Qualified		e0	20	220
WL1831MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TLK3138ZDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2	CMOS	2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	3125 Mbps	S-PBGA-B484	4	2.42 mm	23 mm	Not Qualified		e1	30	260	23 mm
WL1805MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel		-20 Cel			BOTTOM		R-PBGA-B130		2 mm	13.3 mm						13.4 mm
TLK10022CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, HEAT SINK/SLUG			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	10000 Mbps	S-PBGA-B144	4	3.25 mm	13.05 mm			e1	30	260	13.05 mm
LMV1099TL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B25		.675 mm	2.644 mm	Not Qualified					2.771 mm
TPS657051YZHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified		e1	30	260	2.3 mm
TLK4015IGPV	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified		e0	20	220	19 mm
GC4016-PB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM		S-PBGA-B160	3	1.75 mm	15 mm	Not Qualified		e0	20	220	15 mm
TLK4015IZPV	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified		e1	30	260	19 mm
TLK3134ZEL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3750 Mbps	S-PBGA-B289	4	2.48 mm	19 mm	Not Qualified		e1	30	260	19 mm
LMV1099TL/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		S-XBGA-B25	1	.675 mm	2.64 mm			e1	30	260	2.764 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Max)(MHz) : 7000	e1		260	17 mm
CC2560BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
SN65DSI86ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
BQ51010BYFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
SN65DSI96ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
TSC2005IYZLT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B28	1	.625 mm	2.75 mm	Not Qualified		e1	30	260	3.25 mm
BQ51014YFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
BQ51010BYFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
LMX9830SMX	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel	TIN LEAD		BOTTOM		R-PBGA-B60	3	1.3 mm	6 mm	Not Qualified		e0	30	235	9 mm
SN65DSI84ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
CC2564NSYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel			BOTTOM		R-PBGA-B54	1						30	260
BQ51013YFFT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
SN65DSI96ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64		1 mm	5 mm						5 mm
LMX9820ASM	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel		-40 Cel			BOTTOM		R-PBGA-B116		2 mm	9.95 mm						14 mm
BQ51020YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
CC2560BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
CC2564BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 Mbps	R-XBGA-B54	1					e1	30	260
BQ51013YFFR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
CC2564NSYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		R-PBGA-B54	1					e1	30	260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.