BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STA8090EXGAJ	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STPAC01F1	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	UNSPECIFIED	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-XBGA-B8		.715 mm	1.57 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	1.57 mm
STA2500DTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.25 mm	6 mm	Not Qualified		e1	30	260	6 mm
STA8090EXGATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGADTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA2500D	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.25 mm	6 mm	Not Qualified		e1	30	260	6 mm
STA9100MGA	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm				BOTTOM		S-PBGA-B81		1.7 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
STA8090FGBTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
M7020R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified					27 mm
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B8		.715 mm	1.57 mm	Not Qualified					1.57 mm
STA264	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B249				Not Qualified
STA8090EXGA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B169	3	1.2 mm	9 mm			e3		260	9 mm
M7040N-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified		e0			35 mm
STS39230	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20		RECTANGULAR	PLASTIC/EPOXY	YES	1							BGA20(UNSPEC)			85 Cel	-25 Cel		BOTTOM		R-PBGA-B20
ST60A2G0C1C7GYO	STMicroelectronics	TELECOM CIRCUIT		BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.45 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.4 mm	105 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B25		.9 mm	2.2 mm		also operates with 1.8v supply		NOT SPECIFIED	NOT SPECIFIED	2.2 mm
BLUENRGCSP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B34		.5 mm	2.56 mm				NOT SPECIFIED	NOT SPECIFIED	2.66 mm
BLUENRG-345VT	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm						3.14 mm
BLUENRG-355VC	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm						3.14 mm
BLUENRG-355VT	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm						3.14 mm
MC72000	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B100		1.6 mm	7 mm						7 mm
SJA1105EL,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B159		1.5 mm	12 mm						12 mm
PN7150B0UK/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.58 mm	2.8 mm						2.88 mm
SJA1105TEL,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B159		1.5 mm	12 mm						12 mm
PCF26100ET	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,8X8,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B48		1.12 mm	5 mm	Not Qualified					5 mm
MC71000	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B100		1.35 mm	7 mm						7 mm
QN9083DUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm						3.28 mm
BGU8006	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.32 mm	.44 mm						.65 mm
QN9083CUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm						3.28 mm
PN7120A0EV/C1XXXX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.3 mm
PN5441A2ET/C20501	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY				85 Cel	-25 Cel		BOTTOM		S-PBGA-B64
BGU8004X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6	1	.32 mm	.44 mm					260	.65 mm
PCF87852E	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA73,12X12,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B73		1.3 mm	7 mm	Not Qualified			40	260	7 mm
BGU8004	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.32 mm	.44 mm						.65 mm
BGU8004Z	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6	1	.32 mm	.44 mm					260	.65 mm
MC33MR2001VVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001RVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	85	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B85	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001TVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	89	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B89	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001TVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	89	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B89	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001RVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	85	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B85	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001VVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm			e1	40	260	6 mm
PN5180A0ET/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64	1	1.15 mm	5.5 mm			e1	30	260	5.5 mm
PN5180A0ET/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64	1	1.15 mm	5.5 mm			e1	30	260	5.5 mm
PN5120A0ET/C2EL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
PN5120A0ET/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64		1.15 mm	5.5 mm						5.5 mm
PN5120A0ET/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64		1.15 mm	5.5 mm						5.5 mm
BGT60E6327	Infineon Technologies	TELECOM CIRCUIT		BALL	119	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm				BOTTOM		S-PBGA-B119		.8 mm	6 mm						6 mm
PBM99080/22MG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	78	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY, FINE PITCH			.75 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B78			8 mm	Not Qualified					8 mm
PEF22624E	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B324

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.