BALL Other Function Telecom Interface ICs 758

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

DS4000A0/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31404GN+

Maxim Integrated

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

3

Not Qualified

30

260

DS4000ECN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GWN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000D0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000KIN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000N

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS1852B-000+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

DS4000CWN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000EC/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS1852B-000/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS3104GN-W

Maxim Integrated

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

192 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

Not Qualified

20

240

DS31256B

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS4000KI/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS1852B-000+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

DS4000GF/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

20

240

11 mm

DS3131

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.34 mm

27 mm

Not Qualified

e0

27 mm

DS4000A0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GWN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX2667EWT+TW

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B6

1

.69 mm

.865 mm

e2

30

260

1.27 mm

MAX2665EWS+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

Not Qualified

e2

30

260

.84 mm

MAX2669EWT+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B6

1

.69 mm

.865 mm

e2

30

260

1.27 mm

MAX2665EWS+T10

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2664EWS+T10

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2240EBL+TW

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B9

1

.67 mm

e1

30

260

MAX2664EWS+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2839ASEWO+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

73

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

.2 mA

2.8 V

3/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA73(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

BOTTOM

R-PBGA-B73

1

.7 mm

3.61 mm

Not Qualified

30

260

5.11 mm

MAX2240EBL

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

.65 mm

e0

MAX2240EBL+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B9

1

.67 mm

e1

30

260

MAX2669EWT+T10

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B6

.69 mm

.865 mm

30

260

1.27 mm

MAX2665EWS+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2687EWS+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2664EWS+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

Not Qualified

e2

30

260

.84 mm

MAX2667EWT+T10

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B6

.69 mm

.865 mm

30

260

1.27 mm

MAX2689EWS+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

MAX2240EBL-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

.65 mm

e0

MAX2669EWT+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B6

1

.69 mm

.865 mm

Not Qualified

e2

30

260

1.27 mm

TC35661IDBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TB6860WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

39

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B39

.66 mm

2.65 mm

4.25 mm

TC35661DBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TC35675XBG-001

Toshiba

TELECOM CIRCUIT

OTHER

BALL

52

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B52

1.2 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

4.5 mm

TC35661IDBG-008

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TC35661SBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TB6862WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

39

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B39

.66 mm

2.65 mm

4.25 mm

TB31296FT

Toshiba

TELECOM CIRCUIT

OTHER

BALL

48

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

3.3

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,8X8,20

Other Telecom ICs

.5 mm

85 Cel

-35 Cel

TIN LEAD

BOTTOM

S-PBGA-B48

1.2 mm

5 mm

Not Qualified

e0

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.