BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Peak Reflow Temperature (C)	Length
PEF21624E	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B324
PEF24624E	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B324
PBM99090	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	96	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B96						Not Qualified
PBM99080/32MG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	78	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B78						Not Qualified
PEF22817	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B225		1.5 mm			13 mm	Not Qualified			13 mm
PEF24624EV2.2-G	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B324
BGT60	Infineon Technologies	TELECOM CIRCUIT		BALL	119	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm				BOTTOM	S-PBGA-B119	1	.8 mm			6 mm				6 mm
PBA31301/2S	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY				75 Cel	-10 Cel		BOTTOM	R-PBGA-B34						Not Qualified
PBA31301/3	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.775 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM	R-PBGA-B34		1.6 mm			10.2 mm	Not Qualified			14 mm
ROK104001	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	87	BGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.3 V		GRID ARRAY				75 Cel	0 Cel		BOTTOM	R-XBGA-B87						Not Qualified
PBA31301/2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.775 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM	R-PBGA-B34		1.6 mm			10.2 mm	Not Qualified			14 mm
PEF22827	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B225		1.5 mm			13 mm	Not Qualified	e1		13 mm
BGT60E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT		BALL	119	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm				BOTTOM	S-PBGA-B119		.8 mm			6 mm				6 mm
PEF2256EV2.2-G	Infineon Technologies		INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS		145 mA		1.8,3.3	GRID ARRAY	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
PEF2256EV2.2	Infineon Technologies		INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS		145 mA		1.8,3.3	GRID ARRAY	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3		T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		220
PMB8753	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	65	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B65		.8 mm			5 mm	Not Qualified	e1		5 mm
PBA31301/3S	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM	R-PBGA-B34		1.6 mm			10.2 mm	Not Qualified			14 mm
BCM20713A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B50	3	.6 mm			4 mm		e1	260	4.5 mm
BCM20715A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.6 mm			2.509 mm				3.019 mm
BCM4330XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B144		1 mm			6.5 mm				6.5 mm
BCM43241FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm				9 mm
BCM43455HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B140		.6 mm			4.47 mm				5.27 mm
BCM43241XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm				9 mm
BCM4334XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B109		.55 mm			4.08 mm				4.48 mm
BCM4329GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm			5.62 mm				6.57 mm
BCM4334WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B109		.55 mm			4.08 mm				4.48 mm
BCM43241DKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm				9 mm
BCM4354XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm			4.87 mm				7.67 mm
BCM43438KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	R-PBGA-B63		.55 mm			2.87 mm				4.87 mm
BCM4330GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm			4.89 mm				5.33 mm
BCM43241ZKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm				9 mm
BCM20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B121		1.1 mm			9 mm				9 mm
BCM4343WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM	S-PBGA-B74		.55 mm			2.87 mm				4.87 mm
BCM20710A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.6 mm			4 mm				4.5 mm
BCM4325GKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm			7.5 mm				7.5 mm
BCM4329EKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm			5.62 mm				6.57 mm
BCM4354XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm			4.87 mm				7.67 mm
BCM4325FKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B196		1.05 mm			7.5 mm				7.5 mm
BCM88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm			4.87 mm				5.413 mm
BCM43340HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B141		.55 mm			4.47 mm				5.67 mm
BCM43903KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	151	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B151		.55 mm			4.91 mm				5.85 mm
BCM4330FKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm			4.89 mm				5.33 mm
BCM20705A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.8 mm			4 mm				4.5 mm
BCM43241GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm			7 mm				9 mm
BCM4325FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm			5.81 mm				6.51 mm
BCM43303KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B133		.55 mm			4.89 mm				5.33 mm
BCM4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B286		.41 mm			4.87 mm				5.413 mm
BCM4330FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm			4.89 mm				5.33 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.