BALL Other Function Telecom Interface ICs 758

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STLC2690WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	61	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA61,8X8,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B61		.6 mm	3.315 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3.56 mm
STA2500DCTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B48		1.25 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
STW3100	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104				Not Qualified
M7020R-050ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STA260TR	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B289				Not Qualified
M7040N-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
STD8010AWB	STMicroelectronics	TELECOM CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM	S-PBGA-B				Not Qualified
STA2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
MTC20455MB-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	BOTTOM	S-PBGA-B160		1.7 mm	12 mm	Not Qualified	e1			12 mm
STLC2500	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B84		1.2 mm	6 mm	Not Qualified	e1		260	6 mm
E-STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144				Not Qualified	e1
STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified	e0			10 mm
STA260-8X8	STMicroelectronics		INDUSTRIAL	BALL	244	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA244,18X18,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B241				Not Qualified
STHVDAC-253C7	STMicroelectronics	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,14		.35 mm	85 Cel	-30 Cel		BOTTOM	R-XBGA-B12		.64 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.45 mm
STLC2410B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B132		1.2 mm	8 mm	Not Qualified	e1			8 mm
STA8090FGTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B99		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8058	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104				Not Qualified
STA8090EXGAJDTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STA260	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B289				Not Qualified
STLC2500A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B84		1.2 mm	6 mm	Not Qualified				6 mm
STA240	STMicroelectronics		INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,3.3	GRID ARRAY	BGA288,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B288				Not Qualified
STA8058ATR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104				Not Qualified
M7020R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STA2500DC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V	2.75	GRID ARRAY	BGA48,7X7,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B48		1.25 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
M7020R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B144				Not Qualified
M7040N-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
E-STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3			Not Qualified	e1
MTC20136MB-I1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B160		1.7 mm	12 mm	Not Qualified	e1			12 mm
STA8090EXGAD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
STA264TR	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B249				Not Qualified
STA8090EXGAJD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
M7020R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
E-STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B676	3			Not Qualified	e1
STA8058TR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B104				Not Qualified
STW3101	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104				Not Qualified
E-STLC2416	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA120,18X18,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B120		1.4 mm	10 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10 mm
STA8090FG	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B99		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
M7010R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7010R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STLC2411	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B132		1.2 mm	8 mm	Not Qualified	e0			8 mm
STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM	S-PBGA-B676				Not Qualified
M7020R-050ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7040N-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
STI5300ZUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM	S-PBGA-B336				Not Qualified
STA9100MGATR	STMicroelectronics	TELECOM CIRCUIT		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32		.8 mm				BOTTOM	S-PBGA-B81		1.7 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
STLC60845	STMicroelectronics	TELECOM CIRCUIT		BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B292				Not Qualified
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B169		1.2 mm	9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.